Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints

Journal of Materials Research

Volumn 25, Issue 4, 2010, Pages 629-632

  Song, Jenn Ming ^a   Su, Chien Wei ^a   Lai, Yi Shao ^b   Chiu, Ying Ta ^b  

^a NATIONAL DONG HWA UNIVERSITY   (Taiwan)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP PERFORMANCE; CREEP STRESS; ELECTRONIC SOLDERS; INTERFACIAL INTERMETALLICS; INTERMETALLIC COMPOUNDS; SOLDER JOINTS; TIME-DEPENDENT DEFORMATION; WORK HARDENING; YOUNG'S MODULUS;

CREEP; CRYSTAL STRUCTURE; MICROELECTRONICS; NANOINDENTATION; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; YIELD STRESS;

CREEP RESISTANCE;

EID: 77957962130     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2010.0081     Document Type: Article

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