Haptic teleoperation for 3-D microassembly of spherical objects

IEEE/ASME Transactions on Mechatronics

Volumn 17, Issue 1, 2012, Pages 116-127

  Bolopion, Aude ^a   Xie, Hui ^a   Haliyo, Dogan Sinan ^a   Regnier, Stéphane ^a  

^a UNIVERSITÉ PIERRE ET MARIE CURIE   (France)

Author keywords

Bilateral coupling; dual tip gripper; haptic interface; microassembly; virtual guide

Indexed keywords

AMBIENT CONDITIONS; AMPLITUDE MEASUREMENTS; CONTACT POINTS; DYNAMIC MODES; EXPERIMENTAL VALIDATIONS; HAPTIC FEEDBACKS; MICRO ASSEMBLY; MICRO-SCALES; PICK-AND-PLACE; SPHERICAL OBJECTS; TELEOPERATED; TWO LAYERS; VIRTUAL GUIDES;

GRIPPERS; MICE (COMPUTER PERIPHERALS); MICROSPHERES; SPHERES; THREE DIMENSIONAL;

HAPTIC INTERFACES;

EID: 84855978288     PISSN: 10834435     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMECH.2010.2090892     Document Type: Article

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