Intermetallic compounds formed during the soldering reactions of eutectic Sn-9Zn with Cu and Ni substrates

Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques

Volumn 93, Issue 2, 2002, Pages 95-98

  Chan, Y C ^a   Chiu, M Y ^a   Chuang, T H ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Intermetallic compounds; Sn 9Zn Cu; Sn 9Zn Ni; Soldering reactions

Indexed keywords

ACTIVATION ENERGY; DIFFUSION; EUTECTICS; GROWTH KINETICS; INTERFACES (MATERIALS); SOLDERING; SUBSTRATES;

INTERFACIAL REACTIONS; SOLDERING REACTIONS;

INTERMETALLICS;

EID: 0036471978     PISSN: 00443093     EISSN: None     Source Type: Journal    
DOI: 10.3139/146.020095     Document Type: Article

References (12)