Origin of surface defects in PCB final finishes by the electroless nickel immersion gold process

Journal of Electronic Materials

Volumn 37, Issue 4, 2008, Pages 527-534

  Kim, Bae Kyun ^a   Lee, Seong Jae ^a   Kim, Jong Yun ^a   Ji, Kum Young ^a   Yoon, Yeo Joo ^a   Kim, Mi Yang ^a   Park, Song Hae ^a   Yoo, Jong Soo ^a  

^a Samsung Electro Mechanics   (South Korea)

Author keywords

Black pad defects; Electroless nickel immersion gold; Final finishes; Hypercorrosion defects; Joint failures; PCB; Surface defects

Indexed keywords

ELECTROLESS PLATING; GALVANIZING; GOLD; JOINTS (STRUCTURAL COMPONENTS); MICROSTRUCTURE; NICKEL; SURFACE DEFECTS;

BLACK PAD DEFECTS; ELECTROLESS NICKEL IMMERSION GOLD; FINAL FINISHES; HYPERCORROSION DEFECTS;

PRINTED CIRCUIT BOARDS;

EID: 39849104143     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0360-9     Document Type: Article

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