Stress relaxation mechanisms of Sn and SnPb coatings electrodeposited on cu: Avoidance of whiskering

Journal of Electronic Materials

Volumn 40, Issue 11, 2011, Pages 2300-2313

  Sobiech, M ^a,b   Teufel, J ^a,c   Welzel, U ^a   Mittemeijer, E J ^a,c   Hugel W ^b  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

^b ROBERT BOSCH GMBH   (Germany)

^c UNIVERSITY OF STUTTGART   (Germany)

Author keywords

Creep; Residual stresses; Sn whisker; X ray diffraction

Indexed keywords

COLUMNAR GRAIN; EQUIAXED GRAINS; GRAIN COARSENING; MECHANICAL STRESS; MICROSTRUCTURAL CONTROL; PHASE FORMATIONS; PURE SN; RELAXATION MECHANISM; ROOM TEMPERATURE; SN GRAINS; SN WHISKER; STRAIGHT-FORWARD METHOD; STRESS DEVELOPMENT; WHISKER FORMATION;

COATINGS; CREEP; CRYSTAL WHISKERS; LEAD; MORPHOLOGY; RESIDUAL STRESSES; STRESS RELAXATION; TEXTURES; TIN; X RAY DIFFRACTION;

GRAIN GROWTH;

EID: 83155181578     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-011-1737-3     Document Type: Article

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