Whiskers, hillocks, and film stress evolution in electroplated sn and Sn-Cu films

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1498-1504

  Pedigo, A E ^a   Handwerker, C A ^a   Blendell, J E ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER CONTENTS; ELECTRONIC COMPONENTS; PURE TIN; RELAXATION RATES;

CANTILEVER BEAMS; COMPUTER NETWORKS; COPPER PLATING; CRYSTAL GROWTH; DEFECTS; ELECTROCHEMISTRY; ELECTROLYSIS; ELECTROLYTES; ELECTROPLATING; GRAIN BOUNDARIES; GRAIN GROWTH; METALLIC FILMS; PILE FOUNDATIONS; PLATING; STRESS RELIEF; SURFACE DEFECTS; TIN; TIN PLATE; TITANIUM COMPOUNDS;

COPPER;

EID: 51349149966     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550174     Document Type: Conference Paper

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