Investigation of Sn-Cu intermetallic compounds by AFM: New aspects of the role of intermetallic compounds in whisker formation

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 28, Issue 1, 2005, Pages 85-93

  Zhang, Wan ^a   Egli, Andre ^a   Schwager, Felix ^a   Brown, Neil ^a  

^a ROHM AND HAAS COMPANY   (United States)

Author keywords

Atomic force microscopy (AFM); Intermetallic compound (IMC); Tin whisker

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER; CRYSTAL WHISKERS; LEAD; SUBSTRATES; SURFACE TOPOGRAPHY; TIN; TINNING;

COPPER LEAD FRAME MATERIALS; TIN WHISKER;

INTERMETALLICS;

EID: 20444415285     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2005.847441     Document Type: Article

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