The microstructure and state of stress of sn thin films after post-plating annealing: An explanation for the suppression of whisker formation?

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 192-197

  Sobiech, M ^a,b   Welzel, U ^a   Schuster, R ^c   Mittemeijer, E J ^a,c   Hugel W ^b   Seekamp, A ^b   Muller V ^b  

^a MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

^b ROBERT BOSCH GMBH   (Germany)

^c UNIVERSITY OF STUTTGART   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

POST-PLATING ANNEALING; STRESS STATE; WHISKER MITIGATION TREATMENT;

ANNEALING; MICROSTRUCTURE; STRESS ANALYSIS; TENSILE STRESS; X RAY DIFFRACTION; X RAY PHOTOELECTRON SPECTROSCOPY;

THIN FILMS;

EID: 35348863677     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373797     Document Type: Conference Paper

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