Mechanism of generation and suppression of whiskers on electroplated tin and tin-lead films

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Volumn 72, Issue 9, 2008, Pages 648-656

  Murakami, Koji ^a   Okano, Masako ^a   Hino, Makoto ^a   Takamizawa, Masao ^b   Nakai, Kiyomichi ^c  

^a Industrial Technology Research Institute of Okayama Prefectural Government   (Japan)

^b OM Sangyo Co Ltd   (Japan)

^c EHIME UNIVERSITY   (Japan)

Author keywords

Diffusion; Intermetallic compound; Local strain; Nodule; Oxide film; Tin electroplating; Tin lead electroplating; Whisher

Indexed keywords

INTERMETALLIC COMPOUND; LOCAL STRAIN; NODULE; TIN-LEAD ELECTROPLATING; WHISHER;

ATOMIC PHYSICS; ATOMS; COMPRESSION TESTING; DATA COMPRESSION; DIFFUSION; ELECTROCHEMISTRY; ELECTROPLATING; FILM GROWTH; INTERMETALLICS; LEAD COMPOUNDS; METALLIC FILMS; MICROSCOPIC EXAMINATION; NICKEL; NICKEL ALLOYS; OXIDE FILMS; OXIDES; RESIDUAL STRESSES; SEMICONDUCTING INTERMETALLICS; SEMICONDUCTOR DOPING; SOLDERING ALLOYS; STRENGTH OF MATERIALS; SUBSTRATES; SURFACE DIFFUSION; TIN; TITANIUM COMPOUNDS; WELL TESTING; ZIRCONIA; ZIRCONIUM;

COPPER;

EID: 54549083302     PISSN: 00214876     EISSN: None     Source Type: Journal    
DOI: 10.2320/jinstmet.72.648     Document Type: Article

References (14)

1. R. Kawanaka, Y. Fujiwara, K. Tsuji, S. Ito and Y. Ihara: Suzuwisukaseichoupurosesunokaimeitotaisaku, (R&D Planning, 2006) p. 3.
2. R. Kawanaka, S. Nango, T. Hasegawa and M. Ohtani: J. Jpn. Assoc. for Crystal Growth Coop. 10(1983) 148-156.
3. K. Murakami, M. Hino, M. Takamizawa and K. Nakai: J. Jpn. Inst. Metals 72 (2008) 168-175.
4. M. Takamizawa, T. Naka, M. Hino, K. Murakami, Y, Mitooka and K. Nakai: J. Jpn. Inst. Metals 72 (2008) 229-235.
5. B. B. He and K. L. Smith: Proc. 5th Int. Conf. on Residual Stresses, (ICRS-5, Linkoping, Sweden, 1997) pp. 634-639.
6. B. B. He, U. Preckwinkel and K. L. Smith: Advances in X-ray Analysis 42 (1998) 429-438.
7. B. B. He: Prof. 20th ASM Heat Treating Society Conf., (St. Louis, Missouri, 2000) pp. 408-417.
8. B. B. He, X. L. Wang, W. Tang and Y. Chao: Proc. 2001 SEM Spring Conf. on Experimental and Applied Mechanics, (Portland, Oregon, USA, 2001) pp. 547-550.
9. J. R. Kremer, D. N. Mastronarde and J. R. McIntosh: J. Struct. Biol. 116 (1996) 71-76.
10. A. J. Schwartz, M. Kumar and B. L. Adams: Electron Backscatter Diffraction in Materials Science, (Kluwer Academic, 2000) pp. 231-246.
11. J. H. Perepezko: Metall. Trans. A: Phys. Metall, and Mater. Sci. 20 (1989) 785-794.
12. K. Murakami, N. Nishida, K. Osamura, Y. Tomota and T. Suzuki: Acta Mater. 52 (2004) 2173-2184.
13. D. Gupta, K. Vieregge and W. Gust: Acta Mater. 47(1999) 512.
14. B. Peplinski, G. Schulz, D. Schultze, E. Schierhorn and E. Zakel: Mater. Sci. Forum 166-169(1994) 443-448.