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Volumn 225, Issue 7, 2011, Pages 975-989

Machining processes for sapphire wafers: A literature review

Author keywords

Chemical mechanical polishing; Grinding; Lapping; Machining; Polishing; Sapphire wafer; Semiconductor material; Slicing; Wire sawing

Indexed keywords

CUT-OFF; FIXED ABRASIVES; GAN LIGHT-EMITTING DIODES; INNER DIAMETERS; LITERATURE REVIEWS; MACHINING PROCESS; MACHINING TECHNOLOGY; MECHANICAL POLISHING; MULTI-WIRE SAWING; OUTER DIAMETERS; SAPPHIRE WAFER; SLICING; SURFACE FINISHING; WIRE SAWING;

EID: 80054724940     PISSN: 09544054     EISSN: 20412975     Source Type: Journal    
DOI: 10.1177/2041297510393667     Document Type: Conference Paper
Times cited : (90)

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