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Volumn 43, Issue 5, 2003, Pages 523-532

Fixed abrasive diamond wire machining - Part I: Process monitoring and wire tension force

Author keywords

Diamond wire saw; Process monitoring; Wire saw machining

Indexed keywords

ABRASIVES; CAPACITANCE; CERAMIC MATERIALS; CUTTING; DIAMONDS; SENSORS; SIGNAL PROCESSING; WIRE;

EID: 0037392106     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0890-6955(02)00215-8     Document Type: Article
Times cited : (158)

References (47)
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    • Bhagavat, M.1    Kao, I.2
  • 7
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.