-
1
-
-
0023420732
-
Study on machining characteristics of diamond abrasive wire
-
Tokyo, Japan
-
Ito S., Murata R. Study on machining characteristics of diamond abrasive wire. Journal of Mechanical Engineering Lab, Tokyo, Japan. 41:(5):1987;236-244.
-
(1987)
Journal of Mechanical Engineering Lab
, vol.41
, Issue.5
, pp. 236-244
-
-
Ito, S.1
Murata, R.2
-
3
-
-
0028424169
-
Study on machining characteristics of wire tool with electrodeposited diamond grains
-
Ishikawa K., Suwabe H., Kanayama K., Makino M., Yoshida H. Study on machining characteristics of wire tool with electrodeposited diamond grains. Transactions of Japan Society of Mechanical Engineers. 60:(573):1994;1815-1820.
-
(1994)
Transactions of Japan Society of Mechanical Engineers
, vol.60
, Issue.573
, pp. 1815-1820
-
-
Ishikawa, K.1
Suwabe, H.2
Kanayama, K.3
Makino, M.4
Yoshida, H.5
-
4
-
-
0032099414
-
Modeling stresses of contacts in wire saw slicing of polycrystalline and crystalline ingots: Application to silicon wafer production
-
Li J., Kao I., Prasad V. Modeling stresses of contacts in wire saw slicing of polycrystalline and crystalline ingots: application to silicon wafer production. ASME Journal of Electronic Packaging. 120:1998;123-128.
-
(1998)
ASME Journal of Electronic Packaging
, vol.120
, pp. 123-128
-
-
Li, J.1
Kao, I.2
Prasad, V.3
-
5
-
-
0032024951
-
Towards an integrated approach for analysis and design of wafer slicing by a wire saw
-
Sahoo R.K., Prasad V., Kao I., Talbott J., Gupta K.P. Towards an integrated approach for analysis and design of wafer slicing by a wire saw. ASME Journal of Electronic Packaging. 120:1998;35-40.
-
(1998)
ASME Journal of Electronic Packaging
, vol.120
, pp. 35-40
-
-
Sahoo, R.K.1
Prasad, V.2
Kao, I.3
Talbott, J.4
Gupta, K.P.5
-
6
-
-
0033297156
-
Computational model for free abrasive machining of brittle silicon using a wiresaw
-
Nashville, TN, ASME Design Engineering Division, DE-104
-
M. Bhagavat, I. Kao, Computational model for free abrasive machining of brittle silicon using a wiresaw, ASME International Mechanical Engineering Congress and Exposition, Nashville, TN, ASME Design Engineering Division, DE-104, (1999), 21-30.
-
(1999)
ASME International Mechanical Engineering Congress and Exposition
, pp. 21-30
-
-
Bhagavat, M.1
Kao, I.2
-
7
-
-
0034174401
-
Elasto-hydrodynamic interaction in the free abrasive wafer slicing using a wiresaw: Modeling and finite element analysis
-
Bhagavat M., Prasad V., Kao I. Elasto-hydrodynamic interaction in the free abrasive wafer slicing using a wiresaw: modeling and finite element analysis. ASME Journal of Tribology. 122:(2):2000;394-404.
-
(2000)
ASME Journal of Tribology
, vol.122
, Issue.2
, pp. 394-404
-
-
Bhagavat, M.1
Prasad, V.2
Kao, I.3
-
11
-
-
0013163007
-
-
US patent number, 4,494,523
-
R.C. Wells, Wire saw, US patent number, 4,494,523 (1985).
-
(1985)
Wire Saw
-
-
Wells, R.C.1
-
12
-
-
0013070994
-
-
US patent number, 4,655,191
-
R.C. Wells, T.J. Hatfield, Wire saw machine, US patent number, 4,655,191 (1987).
-
(1987)
Wire Saw Machine
-
-
Wells, R.C.1
Hatfield, T.J.2
-
13
-
-
0013157064
-
-
US patent number, 4,903,682
-
T. Kurokawa, Wire saw, US patent number, 4,903,682 (1990).
-
(1990)
Wire Saw
-
-
Kurokawa, T.1
-
15
-
-
0013072252
-
-
US patent number, 5,269,285
-
K. Toyama, E. Kiuchi, K. Hayakawa, Wire saw and slicing method using the same, US patent number, 5,269,285 (1993).
-
(1993)
Wire Saw and Slicing Method Using the Same
-
-
Toyama, K.1
Kiuchi, E.2
Hayakawa, K.3
-
16
-
-
0013162088
-
-
US patent number, 5,564,409
-
R. Bonzo, H.G. Shafer, J.P. Trentelman, Apparatus and method for wire cutting glass-ceramic wafers, US patent number, 5,564,409 (1996).
-
(1996)
Apparatus and Method for Wire Cutting Glass-Ceramic Wafers
-
-
Bonzo, R.1
Shafer, H.G.2
Trentelman, J.P.3
-
22
-
-
0013074150
-
-
US patent number, 5,910,203
-
C. Hauser, Wire saw device, US patent number, 5,910,203 (1999).
-
(1999)
Wire Saw Device
-
-
Hauser, C.1
-
23
-
-
0013072659
-
-
US patent number, 5,944,007
-
K. Miyoshi, T. Suzuki, K. Takahashi, Y. Goto, A. Shiba, S. Wada, Wire type slicing machine and method, US patent number, 5,944,007 (1999).
-
(1999)
Wire Type Slicing Machine and Method
-
-
Miyoshi, K.1
Suzuki, T.2
Takahashi, K.3
Goto, Y.4
Shiba, A.5
Wada, S.6
-
27
-
-
0013072660
-
-
US patent number, 6,102,024
-
S.T. Buljan, R.M. Andrews, Brazed superabrasive wire saw and method therefore, US patent number, 6,102,024 (2000).
-
(2000)
Brazed Superabrasive Wire Saw and Method Therefore
-
-
Buljan, S.T.1
Andrews, R.M.2
-
29
-
-
0013163125
-
-
US patent number, 6,065,461
-
K. Asakawa, H. Oishi, Ingot slicing method and apparatus therefore, US patent number, 6,065,461 (2000).
-
(2000)
Ingot Slicing Method and Apparatus Therefore
-
-
Asakawa, K.1
Oishi, H.2
-
32
-
-
0013074152
-
-
US Parent Number, 6,070,570
-
I. Ueoka, J. Sugawara, A. Mizogouchi, H. Oshita, M. Yamanaka, H. Ogawa, N. Urakawa, H. Yoshinaga, Wire-saw and its manufacturing method, US Parent Number, 6,070,570 (2000).
-
(2000)
Wire-Saw and its Manufacturing Method
-
-
Ueoka, I.1
Sugawara, J.2
Mizogouchi, A.3
Oshita, H.4
Yamanaka, M.5
Ogawa, H.6
Urakawa, N.7
Yoshinaga, H.8
-
33
-
-
0013121390
-
-
US patent number, 6,112,738
-
D.A. Witte, T. Ragan, Method of slicing silicon wafers for laser marking, US patent number, 6,112,738 (2000).
-
(2000)
Method of Slicing Silicon Wafers for Laser Marking
-
-
Witte, D.A.1
Ragan, T.2
-
34
-
-
0013071636
-
-
US patent number, 6,105,568
-
F.C. Yu, Diamond wire saw, US patent number, 6,105,568 (2000).
-
(2000)
Diamond Wire Saw
-
-
Yu, F.C.1
-
37
-
-
0013074154
-
-
US patent number, 6,178,961
-
S. Nagatsuka, S. Okubo, H. Kawarai, H. Oishi, K. Asakawa, J. Matsuzaki, Wire saw control method and wire saw, US patent number, 6,178,961 (2001).
-
(2001)
Wire Saw Control Method and Wire Saw
-
-
Nagatsuka, S.1
Okubo, S.2
Kawarai, H.3
Oishi, H.4
Asakawa, K.5
Matsuzaki, J.6
-
38
-
-
0013121391
-
-
US patent number, 6,178,962
-
S. Ohashi, M. Matsuzawa, Saw wire assembly, cutting method utilizing the same, and system therefore, US patent number, 6,178,962 (2001).
-
(2001)
Saw Wire Assembly, Cutting Method Utilizing the Same, and System Therefore
-
-
Ohashi, S.1
Matsuzawa, M.2
-
40
-
-
0013073025
-
-
US patent number, 6,237,585
-
H. Oishi, K. Asakawa, J. Matsuzaki, Wire Sawing Machine, US patent number, 6,237,585 (2001).
-
(2001)
Wire Sawing Machine
-
-
Oishi, H.1
Asakawa, K.2
Matsuzaki, J.3
-
41
-
-
0013072260
-
-
US patent number, 6,283,111
-
K. Onizaki, K. Ogawa, Wire saw cutting method and apparatus therefore, US patent number, 6,283,111 (2001).
-
(2001)
Wire Saw Cutting Method and Apparatus Therefore
-
-
Onizaki, K.1
Ogawa, K.2
-
42
-
-
0013124751
-
-
US patent number, 6,352,071
-
O. Kononchuk, G. Preece, Apparatus and method for reducing bow and warp in silicon wafers sliced by a wire saw, magnets using wire saw, and voice coil motor, US patent number, 6,352,071 (2002).
-
(2002)
Apparatus and Method for Reducing Bow and Warp in Silicon Wafers Sliced by a Wire Saw, Magnets Using Wire Saw, and Voice Coil Motor
-
-
Kononchuk, O.1
Preece, G.2
-
43
-
-
0013157884
-
-
US patent number, 6,381,830
-
M. Chikuba, H. Ishida, Method for cutting rare earth alloy, method for manufacturing rare earth alloy plates and method for manufacturing rare earth alloy, US patent number, 6,381,830 (2002).
-
(2002)
Method for Cutting Rare Earth Alloy, Method for Manufacturing Rare Earth Alloy Plates and Method for Manufacturing Rare Earth Alloy
-
-
Chikuba, M.1
Ishida, H.2
-
45
-
-
0013070998
-
-
US patent number, 6,422,067
-
H. Oishi, K. Asakawa, J., Matsuzaki, K. Ashida, Slurry useful for wire-saw slicing and evaluation of slurry, US patent number, 6,422,067, (2002).
-
(2002)
Slurry Useful for Wire-Saw Slicing and Evaluation of Slurry
-
-
Oishi, H.1
Asakawa, K.2
Matsuzaki, J.3
Ashida, K.4
-
47
-
-
0037392244
-
Fixed abrasive diamond wire machining - Part II: Experiment design and results
-
Clark W.I., Shih A.J., Hardin C.W., Lemaster R.L., McSpadden S.B. Fixed abrasive diamond wire machining - part II: experiment design and results. International Journal of Machine Tools and Manufacture. 43:2003;533-542.
-
(2003)
International Journal of Machine Tools and Manufacture
, vol.43
, pp. 533-542
-
-
Clark, W.I.1
Shih, A.J.2
Hardin, C.W.3
Lemaster, R.L.4
McSpadden, S.B.5
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