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Volumn 17, Issue 3, 2001, Pages 157-162
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Recent advances in machining of silicon wafers for semiconductor applications
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Author keywords
Chemical mechanical polishing; Grinding; Roughness; Semiconductor; Silicon wafer; Total thickness variation; Turning
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Indexed keywords
CHEMICAL MECHANICAL POLISHING;
GRINDING (MACHINING);
PERFORMANCE;
SAWING;
SILICON WAFERS;
TURNING;
ELECTROLYTIC IN-PROCESS DRESSING;
FREE ABRASIVE MACHINING;
PRECISION SAWING;
SINGLE-POINT DIAMOND TURNING;
TOTAL THICKNESS VARIATION;
WAFER WARP;
MICROELECTRONIC PROCESSING;
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EID: 0034803536
PISSN: 02683768
EISSN: None
Source Type: Journal
DOI: 10.1007/s001700170185 Document Type: Article |
Times cited : (37)
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References (36)
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