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Volumn 17, Issue 3, 2001, Pages 157-162

Recent advances in machining of silicon wafers for semiconductor applications

Author keywords

Chemical mechanical polishing; Grinding; Roughness; Semiconductor; Silicon wafer; Total thickness variation; Turning

Indexed keywords

CHEMICAL MECHANICAL POLISHING; GRINDING (MACHINING); PERFORMANCE; SAWING; SILICON WAFERS; TURNING;

EID: 0034803536     PISSN: 02683768     EISSN: None     Source Type: Journal    
DOI: 10.1007/s001700170185     Document Type: Article
Times cited : (37)

References (36)
  • 2
    • 0003385847 scopus 로고
    • Sematech, Austin TX, USA
    • (1994)
    • Davis, S.1
  • 6
    • 0012114734 scopus 로고
    • Nanometer grinding using ultrafine abrasive pellets - Manufacture of pellets applying electrophoretic deposition
    • (1990) Annals CIRP , vol.40 , Issue.1 , pp. 351-354
    • Ikeno, J.1    Tani, Y.2    Sato, H.3
  • 16
    • 0003385851 scopus 로고
    • Chemical mechanical polishing for ULSI device fabrication
    • Watson Research Centre, Yorktown, New York USA
    • (1995)
    • Kaufmann, F.B.1
  • 19
    • 0002739994 scopus 로고
    • Analysis of mirror surface generation of hard and brittle materials by ELID grinding with superfine grained metallic bonded wheels
    • (1994) Annals CIRP , vol.44 , Issue.1 , pp. 286-290
    • Ohmori, H.1    Nagakawa, T.2
  • 25
    • 0022237391 scopus 로고
    • Indentation hardness and its measurement: Some cautionary comments in micro indentation techniques in materials science and engineering
    • ed. P. J. Blau and B. R. Lawn
    • (1986) ASTM STP , vol.889 , pp. 129-159
    • Tabor, D.1
  • 32
    • 0029694353 scopus 로고    scopus 로고
    • Development of melamine-bonded diamond wheels with high porosity for smooth and mirror finishing of die materials
    • (1996) Annals CIRP , vol.45 , Issue.1 , pp. 315-318
    • Semba, T.1    Tani, Y.2    Sato, H.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.