Fixed abrasive diamond wire saw slicing of single-crystal silicon carbide wafers

Materials and Manufacturing Processes

Volumn 19, Issue 2, 2004, Pages 355-367

  Hardin, Craig W ^a   Qu, Jun ^b   Shih, Albert J ^c  

^a North Carolina State University   (United States)

^b OAK RIDGE NATIONAL LABORATORY   (United States)

^c UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Diamond wire; Scanning acoustic microscopy; Silicon carbide; Wafer slicing; Wire saw

Indexed keywords

ABRASIVES; DIAMONDS; NONDESTRUCTIVE EXAMINATION; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE; SINGLE CRYSTALS; SURFACE TREATMENT;

DIAMOND WIRES; SCANNING ACOUSTIC MICROSCOPY; WAFER SLICING;

SILICON WAFERS;

EID: 2442463480     PISSN: 10426914     EISSN: None     Source Type: Journal    
DOI: 10.1081/AMP-120029960     Document Type: Article

References (11)

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