Modeling stresses of contacts in wire saw slicing of polycrystalline and crystalline ingots: Application to silicon wafer production

Journal of Electronic Packaging, Transactions of the ASME

Volumn 120, Issue 2, 1998, Pages 123-128

  Li, J ^a   Kao, I ^a   Prasad, V ^a  

^a Stony Brook University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COST EFFECTIVENESS; INGOTS; MATHEMATICAL MODELS; POLYCRYSTALLINE MATERIALS; SEMICONDUCTOR DEVICE MANUFACTURE; STRESS ANALYSIS;

WIRE SAW SLICING;

SILICON WAFERS;

EID: 0032099414     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792595     Document Type: Article

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