Understanding simultaneous double-disk grinding: Operation principle and material removal kinematics in silicon wafer planarization

Precision Engineering

Volumn 29, Issue 2, 2005, Pages 189-196

  Pietsch, Georg J ^a   Kerstan, Michael ^a  

^a SILTRONIC AG   (Germany)

Author keywords

Double disk grinding; Flatness; Grinding wheel; Kinematics; Nanotopography; Simultaneous grinding; Wafer preparation

Indexed keywords

ELASTICITY; KINEMATICS; MATHEMATICAL MODELS; MICROELECTRONICS; NANOTECHNOLOGY; SILICON WAFERS; SURFACE TOPOGRAPHY;

DOUBLE-DISK GRINDING; FLATNESS; GRINDING WHEEL; NANOTOPOGRAPHY; SIMULTANEOUS GRINDING; WAFER PROPAGATION;

GRINDING (MACHINING);

EID: 14944365033     PISSN: 01416359     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.precisioneng.2004.07.001     Document Type: Article

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