Development of fixed-abrasive-grain wire saw with less cutting loss

SEI Technical Review

Volumn , Issue 58, 2004, Pages 7-11

  Sugawara, Jun ^a   Hara, Hiroshi ^b   Mizoguchi, Akira ^a  

^a Poly Mat Technol R/D Department   (Japan)

^b Plant Engineering

Author keywords

[No Author keywords available]

Indexed keywords

CUTTING LOSSES; FIXED-ABRASIVE GRAIN WIRE SAWS; PRECISION WIRE SAW (PWS); SINGLE CRYSTAL SILICONE;

ABRASIVES; CAMERAS; COSTS; DATA PROCESSING; DIAMOND CUTTING TOOLS; LIGHT SOURCES; RESINS; SILICON; SINGLE CRYSTALS; WSI CIRCUITS;

METAL WORKING SAWS;

EID: 4043107971     PISSN: 13434349     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)

1. e.g. K. Ishikawa, H. Suwabe: "Development and its Application of Wire Tool Electrodeposited Diamond Grains", KIKAI to KOUGU, 7, p.15, (1996).
2. J. Sugawara, M. Yamakawa, A. Mizoguchi: "Development of Fixed-Abrasive Grain Wire Saw", SEI TECHNICAL REVIEW, 157, p119, (2000).
3. H. Ogawa: "Fixed-abrasive Grains Diamond Wire Saw (PWS®)", JOURNAL OF THE SOCIETY OF GRINDING ENGINEERS, Vol.45, No.8, p384, (2001).