Elasto-hydrodynamic interaction in the free abrasive wafer slicing using a wiresaw: Modeling and finite element analysis

Journal of Tribology

Volumn 122, Issue 2, 2000, Pages 394-404

  Bhagavat, M ^a   Prasad, V ^a   Kao, I ^a  

^a Stony Brook University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASION; ALGORITHMS; ELASTOHYDRODYNAMICS; EQUATIONS OF MOTION; FINITE ELEMENT METHOD; GALERKIN METHODS; MACHINING; MATHEMATICAL MODELS;

FREE ABRASIVE MACHINING (FAM);

TRIBOLOGY;

CUTTING;

EID: 0034174401     PISSN: 07424787     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.555375     Document Type: Article

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