Influence of bonding environment on nano-mechanical properties of nitrogen containing hydrogenated amorphous carbon thin films

Materials Chemistry and Physics

Volumn 130, Issue 1-2, 2011, Pages 775-785

  Dwivedi, Neeraj ^a,b   Kumar, Sushil ^a   Malik, H K ^b   Rauthan, C M S ^a   Panwar, O S ^a  

^a NATIONAL PHYSICAL LABORATORY   (India)

^b INDIAN INSTITUTE OF TECHNOLOGY DELHI   (India)

Author keywords

CVD; FTIR; Mechanical properties; Thin films

Indexed keywords

BONDING ENVIRONMENT; CARBON AND HYDROGENS; CHEMICAL VAPOR; DECONVOLUTING; DISPLACEMENT CURVE; ENERGY DISPERSIVE X-RAY; FOURIER TRANSFORM INFRARED; FT-IR SPECTRUM; FTIR; HIGH QUALITY; HYDROGENATED AMORPHOUS CARBON; ION MASS SPECTROSCOPY; MAXIMUM HARDNESS; NANOMECHANICAL PROPERTY; NITROGEN INCORPORATION; SELF-BIAS; SUPERHARD;

AMORPHOUS CARBON; AMORPHOUS FILMS; BONDING; CARBON FILMS; CHEMICAL ANALYSIS; CHEMICAL VAPOR DEPOSITION; DEPOSITION; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HYDROGENATION; NITROGEN; NITROGEN PLASMA; PLASMA DEPOSITION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SECONDARY ION MASS SPECTROMETRY; THIN FILMS;

MECHANICAL PROPERTIES;

EID: 80052570729     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2011.07.060     Document Type: Article

References (41)

1. A.Y. Liu, and M.L. Cohen Science 245 1989 841
2. A.Y. Liu, and R.M. Wentzcovitch Phys. Rev. B 50 1994 10362
3. N. Dwivedi, S. Kumar, C.M.S. Rauthan, and O.S. Panwar Appl. Phys. A 102 2011 225
4. J. Hao, T. Xu, J. Zhang, and W. Liu J. Phys. D: Appl. Phys. 39 2006 1149
5. S. Kumar, N. Dwivedi, C.M.S. Rauthan, and O.S. Panwar Vacuum 84 2010 882
6. N. Dwivedi, S. Kumar, C.M.S. Rauthan, and O.S. Panwar Plasma Process. Polym. 8 2011 100
7. N. Dwivedi, S. Kumar, Ishpal, S. Dayal, Govind, C.M.S. Rauthan, and O.S. Panwar J. Alloys Compd. 509 2011 1285
8. A. Champi, F.C. Marques, and F.L. Freire Diam. Relat. Mater. 13 2004 1538
9. J.T. Titantah, D. Lamoen, E. Neyts, and A. Bogaerts J. Phys. Condens. Matter 18 2006 10803
10. S. Zhang, H.L. Wang, S.E. Ong, D. Sun, and X.L. Bui Plasma Process. Polym. 4 2007 219
11. S. Hao, B. Delley, S. Veprek, and C. Stampfl Phys. Rev. Lett. 97 2006 086102
12. S. Veprek, and A.S. Argon J. Vac. Sci. Technol. B 20 2002 650
13. M.G. Katsikogianni, C.S. Syndrevelis, E.K. Amanatides, D.S. Mataras, and Y.F. Missirlis Plasma Process. Polym. 4 2007 1046
14. H. Bhaskaran, B. Gotsmann, A. Sebastian, U. Drechsler, M.A. Lantz, M. Despont, P. Jaroenapibal, R.W. Carpick, Y. Chen, and K. Sridharan Nat. Nanotechnol. 5 2010 181
15. N. Dwivedi, S. Kumar, Curr. Appl. Phys., in press.
16. N. Dwivedi, S. Kumar, H.K. Malik, Appl. Surf. Sci., in press.
17. N. Dwivedi, S. Kumar, and H.K. Malik Appl. Surf. Sci. 257 2011 6804
18. J.M. Stillahn, and E.R. Fisher J. Phys. Chem. C 113 2009 1963
19. P.R. Somani, A. Yoshida, R.A. Afre, S. Adhikari, T. Soga, and M. Umeno Phys. Status Solidi A 203 2006 1982
20. E.G. Wang Adv. Mater. 11 1999 1129
21. Ishpal, O.S. Panwar, S. Mahesh, and S. Kumar Mater. Chem. Phys. 125 2011 558
22. S.E. Rodil, N.A. Morrison, J. Robertson, and W.I. Milne Phys. Status Solidi A 174 1999 25
23. M. Ricci, M. Trinquecoste, F. Auguste, R. Canet, P. Delhaes, C. Guimon, G.P. Guillouzo, B. Nysten, and J.P. Issi J. Mater. Res. 8 1993 480
24. H. Xianghan, and B.J. Feldman Solid State Commun. 65 1988 921
25. J. Robertson, INSPEC.
26. M. Sharon, S. Jain, P.D. Kichambare, and M. Kumar Mater. Chem. Phys. 56 1998 284
27. R. Paul, S.N. Das, S. Dalui, R.N. Gayen, R.K. Roy, R. Bhar, and A.K. Pal J. Phys. D Appl. Phys. 41 2008 055309
28. N. Maitre, S. Camelio, A. Barranco, T. Girardeau, and E. Breele J. Non-Cryst. Sol. 351 2005 877
29. S.V. Singh, T. Zaharia, M. Creatore, R. Groenen, K.V. Hege, and M.C.M.V. Sanden J. Appl. Phys. 107 2010 013305
30. B. Johnson, and S. Hogmark Thin Solis Films 114 1984 257
31. A. Erdemir, and C. Donnet J. Phys. D: Appl. Phys. 39 2006 311
32. P.J. Fallon, V.S. Veerasamy, C.A. Davis, J. Robertson, G.A.J. Amaratunga, W.I. Milne, and J. Koskinen Phys. Rev. B 48 1993 4777
33. H. Ito, K. Kanda, and H. Saitoh Diam. Relat. Mater. 17 2008 688
34. S. Singh, M. Pandey, R. Kishore, N. Chand, S. Dash, A. Tyagi, and D. Patil Plasma Process. Polym. 5 2008 853
35. N. Bahadur, A.K. Srivastava, S. Kumar, M. Deepa, and B. Nag Thin Solid Films 518 2010 5257
36. P. Xu, J.J. Li, Q. Wang, Z.L. Wang, C.Z. Gu, and Z. Cui J. Appl. Phys. 101 2007 014312
37. J.R. Shi J. Appl. Phys. 99 2006 033505
38. H. Sjostrom, S. Stafstrom, M. Boman, and J.E. Sundgren Phys. Rev. Lett. 75 1995 1336
39. R. Saha, and W.D. Nix Acta Mater. 50 2002 23
40. X. Chen, and J.J. Vlassak J. Mater. Res. 16 2001 2974
41. J.F. Lin, P.J. Wei, J.C. Pan, and C.F. Ai Diam. Relat. Mater. 13 2004 42