Effect of strain rate and temperature on tensile flow behavior of SnAgCu nanocomposite solders

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2009, Pages 272-277

  Chandra Rao, B S S ^a,b   Mohan Kumar, K ^a   Zeng, K Y ^a   Tay, A A O ^a   Kripesh, V ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Lead free composite solders; Strain hardening exponent; Strain rate

Indexed keywords

COMPOSITE SOLDERS; EFFECT OF STRAIN; ELEVATED TEMPERATURE; FLOW STRESS; FRACTOGRAPHIC FEATURES; HIGHER TEMPERATURES; LEAD-FREE; NANO-SIZED; NANOCOMPOSITE SOLDER; SOLDER ALLOYS; STRAIN RATE DEPENDENCE; STRAIN-HARDENING EXPONENT; TENSILE FLOW; TENSILE FRACTURE SURFACES;

ELECTRONICS PACKAGING; FLOW FIELDS; FLUID DYNAMICS; LEAD; NANOCOMPOSITES; PARTICLE REINFORCED COMPOSITES; PLASTICITY; SILVER; SOLDERING ALLOYS; STRAIN HARDENING; TENSILE STRENGTH; TIN;

STRAIN RATE;

EID: 77950953472     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2009.5416539     Document Type: Conference Paper

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