SCOPUS 정보 검색 플랫폼

Materials Research Society Symposium Proceedings

Volumn 993, Issue , 2007, Pages 13-18

Dissolution kinetics of nickel in lead-free Sn-Bi-In-Zn-Sb soldering alloys

(5) Barmak, Katayun a Berry, David C a Khoruzha, Vira G b Meleshevich, Kostyantyn A b Dybkov, Vasyl I b

a CARNEGIE MELLON UNIVERSITY (United States)

b FRANTSEVICH INSTITUTE FOR PROBLEMS OF MATERIALS SCIENCE (Ukraine)

Author keywords

[No Author keywords available]

Indexed keywords

ANTIMONY ALLOYS; BISMUTH ALLOYS; DISSOLUTION; GROWTH RATE; HAZARDOUS MATERIALS; INDIUM ALLOYS; MICROELECTRONICS; NICKEL ALLOYS; RATE CONSTANTS; SOLDERING; SOLUBILITY; TEMPERATURE DISTRIBUTION; TIN ALLOYS; ZINC ALLOYS;

DISSOLUTION KINETICS; DISSOLUTION PROCESS; DISSOLUTION RATES; INTERMETALLIC LAYER; ROTATING DISC TECHNIQUES; SOLDER INTERFACES; SOLUBILITY VALUE; TEMPERATURE DEPENDENCE;

LEAD-FREE SOLDERS;

EID: 70349932966 PISSN: 02729172 EISSN: None Source Type: Conference Proceeding
DOI: 10.1557/proc-0993-e03-01 Document Type: Conference Paper

Times cited : (5)

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