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Journal of Electronic Materials

Volumn 38, Issue 12, 2009, Pages 2610-2616

Estimation method for liquidus temperature of lead-free solder using differential scanning calorimetry profiles

(3) Nishikawa, Hiroshi a Hamada, Yoshihito b Takemoto, Tadashi a

a OSAKA UNIVERSITY (Japan)

b Uchihashi Estec Co Ltd (Japan)

Author keywords

DSC profile; Estimation method; Extrapolated end temperature; Lead free solder; Liquidus temperature; Peak temperature

Indexed keywords

COOLING PROCESS; DSC PROFILE; ENDOTHERMIC PEAKS; EQUILIBRIUM CONDITIONS; ESTIMATION METHODS; LEAD FREE SOLDERS; LIQUIDUS TEMPERATURE; MELTING TEMPERATURES; ONSET TEMPERATURE; PEAK TEMPERATURES; PROFILE ESTIMATION; SN-PB EUTECTIC SOLDER; SQUARE ROOTS;

DIFFERENTIAL SCANNING CALORIMETRY; ESTIMATION; EXTRAPOLATION; HEATING; HEATING RATE; MELTING POINT; SOLDERING ALLOYS; TIN;

LEAD;

EID: 72549086281 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0921-1 Document Type: Article

Times cited : (20)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.