Application of synchrotron radiation X-ray microtomography to nondestructive evaluation of thermal fatigue process in flip chip interconnects

Journal of Electronic Packaging

Volumn 133, Issue 2, 2011, Pages

  Tsuritani, Hiroyuki ^a   Sayama, Toshihiko ^a   Okamoto, Yoshiyuki ^b   Takayanagi, Takeshi ^b   Uesugi, Kentaro ^c   Mori, Takao ^d  

^a TOYAMA INDUSTRIAL TECHNOLOGY CENTER   (Japan)

^b On Board Standard Design Department   (Japan)

^c JAPAN SYNCHROTRON RADIATION RESEARCH INSTITUTE   (Japan)

^d TOYAMA PREFECTURAL UNIVERSITY   (Japan)

Author keywords

crack propagation; flip chip, nondestructive inspection; life prediction; phase growth; solder joints; synchrotron radiation.; thermal fatigue; x ray microtomography

Indexed keywords

BALL GRID ARRAYS; BINARY ALLOYS; COMPUTERIZED TOMOGRAPHY; FATIGUE CRACK PROPAGATION; FLIP CHIP DEVICES; INSPECTION; INTEGRATED CIRCUIT INTERCONNECTS; INTERMETALLICS; LEAD ALLOYS; MICROSTRUCTURE; NONDESTRUCTIVE EXAMINATION; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; SYNCHROTRONS; THERMAL FATIGUE; TIN ALLOYS;

CRACKS PROPAGATION; FLIP CHIP; FLIP CHIP, NONDESTRUCTIVE INSPECTION; LIFE PREDICTIONS; NON DESTRUCTIVE INSPECTION; PHASE GROWTH; SOLDER JOINTS; SYNCHROTRON RADIATION.; X RAY MICROTOMOGRAPHY; X-RAY MICRO TOMOGRAPHIES;

SYNCHROTRON RADIATION;

EID: 79959732361     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4003992     Document Type: Article

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