Flip chip die attach development for multichip mechatronics power packages

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 24, Issue 4, 2001, Pages 300-306

  Paulasto Kröckel, Mervi ^a   Hauck, Torsten ^a  

^a Motorola GmbH   (Germany)

Author keywords

Automotive mechatronics; Flip chip reliability; Insulated metal substrate; Multichip packaging; Power dissipation

Indexed keywords

CHIP SCALE PACKAGES; ELECTROPLATING; EUTECTICS; MECHATRONICS; MULTICHIP MODULES; SOLDERING ALLOYS; SUBSTRATES;

MULTICHIP MECHATRONICS POWER PACKAGES;

FLIP CHIP DEVICES;

EID: 0035493704     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.980039     Document Type: Article

References (3)

1. Multichip power packaging - Reliability assessment
2. Parametric characterization of flip chip die attach on insulated metal substrate
3. Backside clip connection for power MOSFET device