Analysis of phase growth process in Sn/Pb eutectic solder joint

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 581-587

  Sayama, Toshihiko ^a   Takayanagi, Takeshi ^b   Mori, Takao ^c  

^a TOYAMA INDUSTRIAL TECHNOLOGY CENTER   (Japan)

^b Customer Service Engineering Department   (Japan)

^c TOYAMA PREFECTURAL UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0347663606     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (11)

1. Ardell, A. J., 1972, "On the Coarsening of Grain Boundary Precipitates," Acta Metall., Vol. 20, pp. 601-609.
2. Clark, M. A. and Alden, T. H., 1973, "Deformation Enhanced Grain Growth in a Superplastic Sn-1%Bi Alloy," Acta Metall., Vol. 21, pp. 1195-1206.
3. Frear, D. R., Burchett, S. N. and Neilsen, M. K., 1997, "Life Prediction Modeling of Solder Interconnects for Electronic System," Advances in Electronic Packaging, E. Suhir et al., EEP-Vol. 19-2, pp. 1515-1522.
4. Garafalo, F., Richmond, O., Domis, W. F. and von Gemmingen, F., 1963, "Strain-time, Rate-stress and Rate-temperature Relations during Large Deformation in Creep," Proc. Joint Int. Conf. on Creep, Inst. Mech. Engr., London, Vol. 1, pp. 31-39.
5. Iosipescu, N., 1967, "New Accurate Procedure for Single Shear Testing of Metals," J. of Materials, Vol. 2, No. 3, pp. 537-566.
6. Maruyama, K., Tanaka, C. and Oikawa, H., 1990, "Long-term Creep Curve Prediction Based on the Modified t Projection Concept," Trans. ASME, J. Press. Vess. Technol., Vol. 112, pp. 92-97.
7. Morris, Jr., j. W., Tribula, D., Summers, T. S. E. and Grivas, D., 1991, "The Role of Microstructure in Thermal Fatigue of Pb-Sn Solder Joints," Solder Joint Reliability, J. H. Lau et al., ed., Van Nostrand Reinhold, New York, pp. 225-265.
8. Sayama, T., Takayanagi, T., Takayanagi, M. and Mori, T., 1998, "Proposal of Lap Joint Type Specimen for Measurement of Creep Properties of Solder," Proc. the 75th. JSME Spring Annual Meeting, No. 98-1, Vol. II, pp. 44-45.
9. Senkov, O. N. and Alden, T. H., 1986, "Grain Growth in a Superplastic Zn-22%Al Alloy," Acta Metall., Vol. 34, pp. 97-106.
10. Speight, M. V., 1968, "Growth Kinetics of Grain-Boundary Precipitates," Acta Metall., Vol. 16, pp. 133-135.
11. Yu, Q and Shiratori, M., 1997, "Fatigue-Strength Prediction of Microelectronics Solder Joints under Thermal Cyclic Loading," IEEE Trans. Components, Packaging and Manufacturing Technology, Vol. 20, No. 3, pp. 266-273.