Nondestructive evaluation of thermal phase growth in solder ball microjoints by synchrotron radiation X-ray microtomography

Journal of Electronic Packaging

Volumn 129, Issue 4, 2007, Pages 434-439

  Tsuritani, Hiroyuki ^a   Sayama, Toshihiko ^a   Uesugi, Kentaro ^b   Takayanagi, Takeshi ^c   Mori, Takao ^d  

^a TOYAMA INDUSTRIAL TECHNOLOGY CENTER   (Japan)

^b JAPAN SYNCHROTRON RADIATION RESEARCH INSTITUTE   (Japan)

^c On Board Standard Design Department   (Japan)

^d TOYAMA PREFECTURAL UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COMPUTERIZED TOMOGRAPHY; MICROSTRUCTURE; SOLDERED JOINTS; SYNCHROTRON RADIATION;

HIGH SPATIAL RESOLUTION; SOLDER BALL MICROJOINTS; X-RAY MICROTOMOGRAPHY;

ELECTRONICS PACKAGING;

EID: 38849188788     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2804093     Document Type: Article

References (28)

1. Paulasto-Krockel, M., and Hauck, T., 2001, "Flip Chip Die Attach Development for Multichip Mechatronics Power Package," IEEE Trans. Electron. Packag. Manuf., 24(4), pp. 300-306.
2. Ahn, E. C., Cho, T. J., Shim, J. B., Moon, H. J., Lyu, J. H., Choi, K. W., Kang, S. Y., and Oh, S. Y., 2000, "Reliability of Flip Chip BGA Package on Organic Substrate," Proceedings of the IEEE 2000 Electronic Components and Technology Conference, pp. 1215-1220.
3. Wu, J. D., Zheng, P. J., Lee, C. W., Hung, S. C., and Lee, J. J., 2003, "A Study in Flip-Chip UBM/Bump Reliability With Effects of SnPb Solder Composition," Proceedings of the IEEE 41st Annual International Reliability Physics Symposium, pp. 132-139.
4. Wong, C. W., Tay, C. S., Tan, S. S., Vasudevan, V., Goh, E. H., and Wong, S. F., 2003, "Effect of Package and Board Pad Size on Optimum Flip Chip Ball Grid Array (FCBGA) Package Thermo-Mechanical Performance," Proceedings of InterPACK.2003, Paper No. IPACK2003-35143.
5. Lie, S., and Ume, I. C., 2001, "Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System," Proceedings of Inter PACK2001, Paper No. IPACK2001-15853.
6. Tohmyoh, H., and Saka, M., 2003, "A High-Resolution Dry-Contact Acoustic Imaging of the Solder Joints for Ball Grid Array Assembly," Proceedings of InterPACK2003, Paper No. IPACK2003-35228.
7. Sato, Y., and Miura, H., 2005, "Non-Destructive Inspection Method for Detecting Open Failure in Flip Chip Structures," Proceedings of InterPACK2005, Paper No. IPACK2005-73109.
8. Moore, T. D., Vanderstraeten, D., and Forssell, M., 2002, "Three-Dimensional X-Ray Laminography as a Tool for Detecting and Characterization of BGA Package Defects," IEEE Trans. Compon. Packag. Technol., 25(2), pp. 224-229.
9. Sasov, A., 2001, "Microlaminography for High-Resolution BGA and Flip-Chip Inspection," Proc. SPIE, 4406, pp. 71-75.
10. Bernard, D., Hoo, N., and Lodge, D., 2004, "Use of Digital X-Ray Imaging as a Process Control Tool for Lead-Free PWB Assembly," Proceedings of the 2004 Surface Mount Technology Association International Conference, pp. 548-552.
11. Nakano, T., Nakashima, Y., Nakamura, K., and Ikeda, S., 2000, "Observation and Analysis of Internal Structure of Rock Using X-Ray CT," J. Geol. Soc. Japan, 106(5), pp. 363-378.
12. Danczak, M., Wolter, K. J., Rieske, R., and Roth, H., 2003, "Application of Computer Tomography in Electronic Technology," Proceedings of the IEEE 26th International Spring Seminar on Electronics Technology, pp. 108-111.
13. Tsuchiyama, A., Uesugi, K., Nakano, T., and Ikeda, S., 2005, "Quantitative Evaluation of Attenuation Contrast of X-Ray Computed Tomography Images Using Monochromatized Beams," Am. Mineral., 90, pp. 132-142.
14. p, Using X-Ray Synchrotron Phase Contrast Microtomography," Acta Mater., 47, pp. 1613-1625.
15. Uesugi, K., Tsuchiyama, A., Nakano, T., Suzuki, Y., Yagi, N., Umetani, K., and Kohmura, Y., 1999, "Development of Micro-Tomography Imaging System for Rock and Mineral Samples," Proc. SPIE, 3772, pp. 214-221.
16. Uesugi, K., Suzuki, Y., Yagi, N., Tsuchiyama, A., and Nakano, T., 2001, "Development of High Spatial Resolution X-Ray CT System at BL47XU in SPring-8," Nucl. Instrum. Methods Phys. Res. A, 467-468, pp. 853-856.
17. Tsuchiyama, A., Uesugi, K., and Nakano, T., 2000, "A Study of Three-Dimensional Structures of Rocks and Minerals Using a High-Resolution X-Ray CT Method," J. Geography, 109(6), pp. 845-858.
18. Yasuda, H., Ohnaka, I., Tsuchiyama, A., Nakano, T., and Uesugi, K., 2003, "3D Observation of the Solidified Structure by X-Ray Micro Computerized Tomography," J. Japanese Society for Synchrotron Radiation Research, 16(2), pp. 21-26.
19. Toda, H., Ohgaki, T., Uesugi, K., Kobayashi, M., Kuroda, N., Kobayashi, T., Niinomi, M., Akahori, T., Makii, K., and Aruga, Y., 2006, "Quantitative Assessment of Microstructure and Its Effects on Compression Behaviour of Aluminium Foams Via High-Resolution Synchrotron X-Ray Tomography," Metall. Mater. Trans. A, 37A, pp. 1211-1220.
20. http://www.spring8.or.jp/en/users/new_user/sr/
21. Suzuki, Y., Takeuchi, A., Takano, H., Uesugi, K., Oka, T., and Inoue, K., 2004, "X-Ray Imaging Microscopy Using Fresnel Zone Plate Objective and Quasi-monochromatic Undulator Radiation," Rev. Sci. Instrum., 75, pp. 1155-1157.
22. 1988, "Basic Environmental Testing Procedures. Part 2: Tests, Test N: Change of Temperature," Standard No. JIS C 0025.
23. Uesugi, K., Suzuki, Y., Takano, H., Tamura, S., Kamijo, N., and Yagi, N., 2004, "Direct Measurement of the Resolving Power of X-Ray CT System at SPring-8," AIPConf. Proc., 705, pp. 1316-1319.
24. Takano, H., Suzuki, Y., Uesugi, K., Takeuchi, A., and Yagi, N., 2001, "PSF Measurement of Imaging Detectors With an X-Ray Microbeam," Proc. SPIE, 4499, pp. 126-133.
25. Morris, J. W., Jr., Tribula, D., Summers, T. S. E., and Grivas, D., 1991, Solder Joint Reliability, J. H. Lau, ed., Van Nostrand Reinhold, New York, p. 225.
26. Sayama, T., Takayanagi, T., and Mori, T., 1999, "Analysis of Phase Growth Process in Sn-Pb Eutectic Solder Joints," Advances in Electronic Packaging, D. Agonafer, M. Saka, and Y.-C. Lee, eds., ASME, New York, EEP-Vol. 26-1, pp. 581-587.
27. 1996, "Standard Test Methods for Determining Average Grain Size," Standard No. ASTM E112.
28. Sayama, T., Takayanagi, T., and Mori, T., 2001, "A Microstructural Evaluation Method of Thermal Fatigue Crack Initiation in Sn-Pb Eutectic Solder Joints," Proceedings of InterPACK'01, ASME, New York, Paper No. IPACK2001-15572.