Digital signal processing in a novel flip chip solder joint defects inspection system

Journal of Electronic Packaging

Volumn 125, Issue 1, 2003, Pages 39-43

  Liu, Sheng ^a   Ume, I Charles ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; DIGITAL SIGNAL PROCESSING; ERRORS; FLIP CHIP DEVICES; FREQUENCY DOMAIN ANALYSIS; INTERFEROMETRY; LASER APPLICATIONS; QUALITY ASSURANCE; SIGNAL TO NOISE RATIO; SOLDERED JOINTS; TIME DOMAIN ANALYSIS; ULTRASONIC APPLICATIONS;

BARTLETT POWER SPECTRUM ESTIMATION METHOD; DIGITAL FILTERING; ERROR RATIO; FLIP CHIP SOLDER JOINT; LASER ULTRASOUND; QUALITY INSPECTION SYSTEM;

CHIP SCALE PACKAGES;

EID: 0344551089     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1525820     Document Type: Article

References (9)

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