Reliability of lead-ree solder interconnections in thermal and power cycling tests

IEEE Transactions on Components and Packaging Technologies

Volumn 32, Issue 2, 2009, Pages 302-308

  Li, Jue ^a   Karppinen, Juha ^a   Laurila, Tomi ^a   Kivilahti, Jorma Kalevi ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

Finite element method (FEM; Lead free; Power cycling test; Reliability; Solder joint; Thermal shock test

Indexed keywords

FINITE-ELEMENT METHOD (FEM; LEAD FREE; POWER CYCLING TEST; SOLDER JOINT; THERMAL SHOCK TEST;

BRAZING; DIES; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; LEAD; QUALITY ASSURANCE; RELIABILITY ANALYSIS; THERMAL CYCLING; THERMAL SHOCK; THREE DIMENSIONAL; WELDING;

TESTING;

EID: 68349144147     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2012518     Document Type: Article

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