Automated solder inspection technique for BGA-Mounted substrates by means of oblique computed tomography

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 30, Issue 4, 2007, Pages 285-292

  Teramoto, Atsushi ^a   Murakoshi, Takayuki ^a   Tsuzaka, Masatoshi ^b   Fujita, Hiroshi ^c  

^a Nagoya Electric Works Company Limited   (Japan)

^b NAGOYA UNIVERSITY   (Japan)

^c GIFU UNIVERSITY   (Japan)

Author keywords

Ball grid array (BGA); Bump; Computed tomography (CT); Inspection; X rays

Indexed keywords

INSPECTION; NEURAL NETWORKS; SOLDERING; TOMOGRAPHY;

BUMP EXTRACTION; CHARACTER EXTRACTION; CHARACTER JUDGEMENT; OBLIQUE COMPUTED TOMOGRAPHY; POSITION ADJUSTMENT;

BALL GRID ARRAYS;

EID: 35348820607     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2007.907574     Document Type: Article

References (15)

1. P. Haglund, P. Frisk, and J. O. Andersson, "BGA-MCM technology for harsh environmental applications," in ISHM-Eur., 1997, pp. 14-16.
2. R. Ghaffarian, "BGAs for high reliability applications," Electron. Packag. Prod., vol. 38, no. 3, pp. 45-52, 1998.
3. D. Geiger and D. Shangguan, "X-ray inspection of area array packages using tin-lead and lead-free solders," in Proc. Surface Mount Int. (SMTA), Chicago, IL, Sep. 26-30,2004, pp. 26-30.
4. T. Hamada, K. Nakahata, S. Fushimi, Y. Morioka, and T. Nisluda, "Automatic solder joint inspection system by X-ray imaging," (in Japanese) J. Precise Eng., vol. 59, no. 1, pp. 65-71, 1993.
5. A. Teramoto and I. Horiba, "Extraction of solder constituent from CSP boards by means of X-ray energy subtraction method," (in Japanese) J. Jpn. Inst. Electron. Packag., vol. 4, no. 1, pp. 68-71, 2001.
6. A. Teramoto, T. Murakoshi, and I. Horiba, "High speed and high precision solder bump inspection method using X-ray fluoroscopy," (in Japanese) IEEJ Trans. Ind. Applicat., vol. 125-D, no. 6, pp. 652-658, 2005.
7. A. Teramoto, T. Murakoshi, M. Tsuzaka, and H. Fujita, "Automated detection of micro void in solder bump," (in Japanese) IEEJ Trans. Ind. Applicat., vol. 126-D, no. 11, pp. 1514-1521, 2006.
8. G. Leinbach and S. Rooks, "Process variation evaluation via X-ray laminography," Surface Mount Technol., pp. 38-40, Apr. 1995.
9. S. M. Rooks, B. Benhabib, and K. C. Smith, "Development of an inspection process for ball-grid-array technology using scanned-beam X-ray laminography," IEEE Trans. Compon., Packag., Manuf. Technol. vol. 18, no. 4, pp. 851-861, Dec. 1995.
10. V. Sankaran, A. R. Kalukin, and R. P. Kraft, "Improvements to X-ray laminography for automated inspection of solder joints," IEEE Trans. Compon, Tackag., Manuf. Technol., vol. 21, no. 2, pp. 148-154, Apr. 1998.
11. A. Teramoto, T. Murakoshi, M. Tsuzaka, and H. Fujita, "High speed oblique X-ray CT system for printed circuit board," SICE Trans. Ind. Applicat., vol. 6, no. 9, pp. 72-77, Jun. 2007.
12. W. Doyle, "Operations useful for similarity-invariant pattern recognition," J. ACM, vol. 9, pp. 259-267, 1962.
13. F. Murtagh and A. Heck, Multivariate Data Analysis. Dordrecht, The Netherlands: Astrophysics and Space Science Library, 1987.
14. D. E. Rumelhart and J. L. McClellandthe, Parallel Distributed Processing. Cambridge, MA: MIT Press, 1986, vol. 1 and 2.
15. R. Battiti, "First and second order methods for learning: Between steepest descent and Newton's method," Neural Comput., vol. 4, no. 2, pp. 141-166, 1992.