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Volumn 25, Issue 2, 2002, Pages 224-229
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Three-dimensional x-ray laminography as a tool for detection and characterization of BGA package defects
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Author keywords
2 D; Ball grid array; Failure analysis; Nondestructive reconstruction; Tomography; X ray
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Indexed keywords
BALL GRID ARRAY (BGA) PACKAGES;
MICROLAMINOGRAPHY;
ARRAYS;
CHARACTERIZATION;
DEFECTS;
FAILURE ANALYSIS;
INTEGRATED CIRCUITS;
NONDESTRUCTIVE EXAMINATION;
PRINTED CIRCUIT BOARDS;
SOLDERING;
SUBSTRATES;
TOMOGRAPHY;
X RAY ANALYSIS;
ELECTRONICS PACKAGING;
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EID: 0036613732
PISSN: 15213331
EISSN: None
Source Type: Journal
DOI: 10.1109/TCAPT.2002.1010010 Document Type: Article |
Times cited : (79)
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References (11)
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