SCOPUS 정보 검색 플랫폼

Volumn 46, Issue 11, 2005, Pages 2309-2315

Isothermal fatigue properties of Sn-Ag-Cu alloy evaluated by micro size specimen

Author keywords

Crack initiation; Damage mechanism; Fatigue life; Lead free solder; Micro bulk; Miniature testing; Solder; Tin lead; Tin silver copper

Indexed keywords

DAMAGE MECHANISM; LEAD-FREE SOLDER; MICRO-BULK; MINIATURE TESTING; SOLDER; TIN-LEAD; TIN-SILVER-COPPER;

CRACK INITIATION; EXTRUSION; FATIGUE OF MATERIALS; GRAIN BOUNDARIES; ISOTHERMS; SOLDERING ALLOYS;

TIN ALLOYS;

EID: 30844470686 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.46.2309 Document Type: Article

Times cited : (48)

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