Oblique view cone beam tomography for inspection of flat-shape objects

Key Engineering Materials

Volumn 270-273, Issue II, 2004, Pages 1135-1142

  Misawa, Masaki ^a   Tiseanu, Ion ^b   Hirashima, Ryusuke ^c   Koizumi, Kazuto ^c   Ikeda, Yasushi ^d  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b NATIONAL INSTITUTE FOR LASER   (Romania)

^c Uni Hite System Corporation   (Japan)

^d JAPAN FINE CERAMICS CENTER   (Japan)

Author keywords

BGA; Cone beam tomography; Flat object; Micro structure; Print circuit board

Indexed keywords

BONDING; CHIP SCALE PACKAGES; FIBER REINFORCED PLASTICS; MICROSTRUCTURE; MULTILAYERS; PRINTED CIRCUIT BOARDS; SOLDERING; X RAYS;

BALL GRID ARRAYS (BGA); CHIP SET PACKAGE (CSP); CONE BEAM TOMOGRAPHY; FLAT OBJECT;

TOMOGRAPHY;

EID: 8644233376     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/kem.270-273.1135     Document Type: Conference Paper

References (5)

1. Y.IKeda, Y. Mizuta, R. Hirashima: "A New U-centric Radioscopy System for BGA and LSI", Proc. 15th World Conference on Nondestructive Testing, CD-ROM, Roma, Italy (2000-10).
2. A.-H. Benouali, L. Froyen, M. Wevers: X-ray Tomography in Materials Science, Chapter 10, pp.139-153, Hermes Science Publications, Paris (2000).
3. S.Gondrom, S.Schropfer "Digital computed laminography and tomosynthesis-functional principles and industrial applications", Proc. Computerized Tomography for Industrial Applications and Image Processing in Radiology, BB67-CD, paper 11, pp.75-81, Berlin, Germany (1999-3).
4. L.A.Feldkamp, L.C.Davis, and J. W.Kress: "Practical cone beam algorithm", J. Opt. Soc. Ame. A, Vol.1 No.6 (1984), pp. 612-619.
5. Z. Yang and R. Maeda, Ultrasonic micro-degassing device, IEEE MEMS 2001 (2001) pp. 471-474.