Early dissolution behavior of copper in a molten Sn-Zn-Ag solder

Journal of Materials Research

Volumn 20, Issue 3, 2005, Pages 666-671

  Yu, Chang Ho ^a   Lin, Kwang Lung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS ALLOYS; CRYSTAL LATTICES; DISSOLUTION; LIQUID METALS; MOLECULAR DYNAMICS; QUENCHING; SOLDERING ALLOYS; THERMAL EFFECTS; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY;

AMORPHOUS STRUCTURE; ATOMIC CLUSTER ZONE; ATOMIC LEVEL DISSOLUTION; HIGH-RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; MOLTEN SOLDER; THERMAL VIBRATION;

COPPER;

EID: 29044448033     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2005.0080     Document Type: Article

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