Suppressing growth of the Cu 5Zn 8 intermetallic layer in Sn-Zn-Ag-Al-Ga/Cu solder joints

Journal of Electronic Materials

Volumn 38, Issue 1, 2009, Pages 88-92

  Lai, R S ^a   Lin, K L ^a   Salam, B ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Intermetallic compound; Lead free solder; Sn Zn alloy

Indexed keywords

CU METALLIZATION; INTERMETALLIC COMPOUND; INTERMETALLIC LAYERS; LEAD-FREE SOLDER; SILVER CONTENTS; SN-ZN ALLOY; SOLDER JOINTS;

ALUMINUM; BRAZING; COPPER; COPPER ALLOYS; GROWTH (MATERIALS); INTERMETALLICS; LEAD; LEAD COMPOUNDS; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS; WELDING; ZINC; ZINC ALLOYS;

TIN;

EID: 57649157645     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0579-0     Document Type: Conference Paper

References (9)

1. N.S. Liu K.L. Lin 2006 Scr. Mater. 54 219 10.1016/j.scriptamat.2005.09. 033
2. K.L. Lin Y.T. Chiu 2005 Proc. Electron Comp. Tech. Conf. 1 692
3. K.I. Chen S.C. Cheng S. Wu K.L. Lin 2006 J. Alloy Comp. 416 98 10.1016/j.jallcom.2005.08.034
4. Y. Kariya T. Hosoi S. Terashima M. Tanaka M. Otsuka 2004 J. Electron. Mater. 33 321 10.1007/s11664-004-0138-2
5. J.W. Evans J.Y. Evans S.M. Hull 1993 Int. J. Microcirc. Electron. Pack. 16 363
6. F. Yost, F. Hosking, and D. Frear, The Mechanics of Solder Alloy Wetting and Spreading (New York, NY: Van Nostrand Reinhold, 1993), 148 pp
7. R. Hultgren, R.L. Orr, P.D. Anderson, and K.K. Kelley, Selective Values of Thermodynamics Properties of Metals and Alloys, Chap. 3 (Wiley, 1990), 399 pp
8. P. Villars, Pearson's Handbook of Crystallographic Data for Intermetallic Phases, (ASM International, Materials Park, OH, 1997)
9. J.L.C. Daams, P. Villars, and J.H.N. van Vucht, Atlas of Crystal Structure Types for Intermetallic Phases (Materials Park: ASM International, 1991), pp. 6680-6683, 6799