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Materials Transactions

Volumn 46, Issue 1, 2005, Pages 42-47

Microstructure and mechanical properties of Sn-8.55Zn-1Ag-XAI solder alloys

(2) Cheng, Shou Chang a Lin, Kwang Lung b

a TUNG FANG INSTITUTE OF TECHNOLOGY (Taiwan)

b NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

Author keywords

Fracture; Hardness, lead free solder; Mechanical property; Microstructure; Tension test

Indexed keywords

FRACTURE; MECHANICAL PROPERTIES; MICROSTRUCTURE; SOLDERING ALLOYS; TENSILE STRESS; TENSILE TESTING; VICKERS HARDNESS TESTING;

HARDNESS, LEAD-FREE SOLDER; LEAD-FREE SOLDERS; OFFSET YIELD STRESS; SOLDER ALLOYS;

TIN ALLOYS;

EID: 33646526806 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.46.42 Document Type: Article

Times cited : (14)

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