Effect of heat treatment temperature on the microstructure and actuation behavior of a Ti-Ni-Cu thin film microactuator

Acta Materialia

Volumn 58, Issue 18, 2010, Pages 6064-6071

  Tomozawa, M ^a,b   Kim, H Y ^a   Yamamoto, A ^b   Hiromoto, S ^b   Miyazaki, S ^a  

^a UNIVERSITY OF TSUKUBA   (Japan)

^b NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

Microactuator; Shape memory effect; Thin film; Ti Ni Cu

Indexed keywords

DIAPHRAGMS; HEAT TREATMENT; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; MICROACTUATORS; MICROSTRUCTURE; NICKEL; SHAPE MEMORY EFFECT; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

EFFECT OF HEAT TREATMENTS; HEAT TREATMENT TEMPERATURE; INTERFACIAL STRUCTURES; INTERNAL STRUCTURE; QUASI-STATIC CONDITIONS; REACTION LAYERS; TI-NI-CU; TRANSFORMATION TEMPERATURES;

COPPER;

EID: 79955457941     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2010.07.024     Document Type: Article

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