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Journal of Materials Chemistry

Volumn 21, Issue 12, 2011, Pages 4657-4662

Direct pattern transfer using an inorganic polymer-derived silicate etch mask

(5) Fang, Qingling a,b Li, Xiaodong a Tuan, Anh Pham c Perumal, Jayakumar b Kim, Dong Pyo b

a NATIONAL UNIVERSITY OF DEFENSE TECHNOLOGY (China)

b Chungnam National University (South Korea)

c Lab of Physico chemical Parameters and Reference Materials (Viet Nam)

Author keywords

[No Author keywords available]

Indexed keywords

CONVENTIONAL PHOTOLITHOGRAPHY; DRY PLASMAS; ETCH MASK; ETCHING SELECTIVITY; FACILE FABRICATION; MICRON SCALE; PATTERN TRANSFERS; POLYMER PHASE; POST-HEAT TREATMENT; SEMICONDUCTOR INDUSTRY; SILICATE PHASE; SILICATE PRECURSORS;

DRY ETCHING; INORGANIC POLYMERS; PHOTORESISTS; PLASMA ETCHING; SEMICONDUCTING SILICON COMPOUNDS; SEMICONDUCTOR DEVICE MANUFACTURE; SILICATES;

SILICON WAFERS;

EID: 79952593627 PISSN: 09599428 EISSN: 13645501 Source Type: Journal
DOI: 10.1039/c0jm03869e Document Type: Article

Times cited : (10)

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