Systematic Strategy for Modeling and Optimization of Thermal Systems with Design Uncertainties

Frontiers in Heat and Mass Transfer

Volumn 1, Issue 1, 2010, Pages

  Lin, Po Ting ^a   Gea, Hae Chang ^a   Jaluria, Yogesh ^a  

^a RUTGERS UNIVERSITY   (United States)

Author keywords

Chemical vapor deposition (CVD); Performance measure approach (PMA); Radial basis function (RBF); Reliability index approach (RIA); Reliability based design optimization (RBDO); Response surface method (RSM)

Indexed keywords

ATMOSPHERIC TEMPERATURE; DEPOSITION RATES; FUNCTIONS; INTELLIGENT SYSTEMS; MACHINE DESIGN; MONTE CARLO METHODS; NORMAL DISTRIBUTION; PRODUCTIVITY; RADIAL BASIS FUNCTION NETWORKS; RELIABILITY; SURFACE PROPERTIES; SYSTEMS ENGINEERING; TAGUCHI METHODS; UNCERTAINTY ANALYSIS; WEIBULL DISTRIBUTION;

BASE FUNCTION; CHEMICAL VAPOR DEPOSITION; CHEMICAL VAPOUR DEPOSITION; PERFORMANCE MEASURE APPROACH; PERFORMANCE MEASURE APPROACHES; RADIAL BASE FUNCTION; RADIAL BASIS; RELIABILITY INDEX; RELIABILITY INDEX APPROACH; RELIABILITY-BASED DESIGN OPTIMIZATION; RESPONSE SURFACE METHOD; RESPONSE SURFACES METHODS;

CHEMICAL VAPOR DEPOSITION;

EID: 79952024480     PISSN: None     EISSN: 21518629     Source Type: Journal    
DOI: 10.5098/hmt.v1.1.3003     Document Type: Article

References (85)

1. Allen, S.D., 1981, Laser Chemical Vapor Deposition: A Technique for Selective Area Deposition, Journal of Applied Physics, 52(11), 6501-6505. doi: 10.1063/1.328600
2. Breiland, W.G. and Coltrin, M.E., 1990, Si Deposition Rates in a Two- Dimensional CVD Reactor and Comparisons with Model Calculations, Journal of The Electrochemical Society, 137, 2313-2319. doi: 10.1149/1.2086933
3. Cheng, H.-E., Chiang, M.-J., and Han, M.-H., 1995, Growth Characteristics and Properties of TiN Coating by Chemical Vapor Deposition, Journal of The Electrochemical Society, 142, 1573-1578. doi: 10.1149/1.2048615
4. Chiu, W.K.S., 1999, Simulation, Design and Optimization of Chemical Vapor Deposition systems for Advanced Materials, Dissertation, Mechanical and Aerospace Engineering, Rutgers University.
5. Chiu, W.K.S. and Jaluria, Y., 1997, Heat Transfer in Horizontal and Vertical CVD Reactors, ASME Heat Transfer Divison, 347, 293-311.
6. Chiu, W.K.S. and Jaluria, Y., 1999, Effect of Buoyancy, Susceptor Motion, and Conjugate Transport in Chemical Vapor Deposition Systems, Journal of Heat Transfer, 121, 757-761. doi: 10.1115/1.2826049
7. Chiu, W.K.S. and Jaluria, Y., 2000, Continuous Chemical Vapor Deposition Processing with a Moving Finite Thickness Susceptor, Journal of Materials Research, 15, 317-328. doi: 10.1557/JMR.2000.0050
8. Chiu, W.K.S., Jaluria, Y., and Glumac, N.G., 2000, Numerical Simulation of Chemical Vapor Deposition Processes Under Variable and Constant Property Approximations, Numerical Heat Transfer, 37, 113-132. doi: 10.1080/104077800274334
9. Chiu, W.K.S., Jaluria, Y., and Glumac, N.G., 2002, Control of Thin Film Growth in Chemical Vapor Deposition Manufacturing Systems: A Feasibility Study, Journal of Manufacturing Science and Engineering, 124, 715-724. doi: 10.1115/1.1465434
10. Chiu, W.K.S., Richards, C.J., and Jaluria, Y., 2000, Flow Structure and Heat Transfer in a Horizontal Converging Channel Heated From Below, Physics of Fluids, 12, 2128-2136. doi: 10.1063/1.870458
11. Chiu, W.K.S., Richards, C.J., and Jaluria, Y., 2001, Experimental and Numerical Study of Conjugate Heat Transfer in a Horizontal Channel Heated From Below, Journal of Heat Transfer, 123, 688-697. doi: 10.1115/1.1372316
12. Creighton, J.R. and Parmeter, J.E., 1993, ''Metal CVD for Microelectronic Applications: An Examination of Surface Chemistry and Kinetics,'' Critical Reviews in Solid State and Materials Sciences, 18, 175-238. doi: 10.1080/10408439308242560
13. Den Hertog, D., Kleijnen, J.P.C., and Siem, A.Y.D., 2006, The Correct Kriging Variance Estimated by Bootstrapping, Journal of the Operational Research Society, 57(4), 400-409. doi: 10.1057/palgrave.jors.2601997
14. Dimitrios, I., Kremer, A.M., McKenna, D.R., and Jensen, K.F., 1987, Complex Flow Phenomena in Vertical MOCVD Reactors: Effects on Deposition Uniformity and Interface Abruptness, Journal of Crystal Growth, 85, 154-164.
15. Duchon, J., 1977, ''Splines Minimizing Rotation-Invariant Semi-Norms in Sobolev Spaces,'' Schempp, W. and Zeller, K. eds., Constructive Theory of Functions of Several Variables, Springer Berlin/Heidelberg, 85-100. doi: 10.1007/BFb0086566
16. Eden, J.G., 1991, Photochemical Vapor Deposition, Vossen, J.L. and Kern, W. eds., Thin Film Processes II, Academic Press, Inc., San Diego, CA.
17. Eversteyn, F.C., Severin, P.J.W., van den Brekel, C.H.J., and Peek, H.L., 1970, A Stagnant Layer Model for the Epitaxial Growth of Silicon from Silane on a Horizontal Reactor, Journal of The Electrochemical Society, 117, 925-931. doi: 10.1149/1.2407685
18. Fotiadis, D.I., Boekholt, M., Jensen, K.F., and Richter, W., 1990, Flow and Heat Transfer in CVD Reactors: Comparison of Raman Temperature Measurements and Finite Element Predictions, Journal of Crystal Growth, 100, 577-599. doi: 10.1016/0022-0248(90)90257-L
19. th ed., Wiley, New York.
20. Foxon, C.T., 1994, Principles of Molecular Beam Epitaxy, Hurle, D. ed. Handbook of Crystal Growth, Elsevier, Amsterdam.
21. Fraser, D.B., 1983, ''Metallization,'' Sze, S.M. ed. VLSI Technology, McGraw-Hill, New York, 347.
22. Gardeniers, J.G.E., Maas, W.E.J.R., Van Meerten, R.Z.C., and Giling, L.J., 1989, Influence of Temperature on the Crystal Habit of Silicon in the Si-H-Cl CVD System: I. Experimental Results, Journal of Crystal Growth, 96, 821-842. doi: 10.1016/0022-0248(89)90642-8
23. Gebhart, B., Jaluria, Y., Mahajan, R.L., and Sammakia, B., 1988, Buoyancy-Induced Flows and Transport, Taylor & Francis, Philadelphia, PA.
24. George, P., 2007, Simulation and Optimization of the Chemical Vapor Deposition Process, Dissertation, Mechanical and Aerospace Engineering, Rutgers University.
25. George, P., Lin, P.T., Gea, H.C., and Jaluria, Y., 2009, Reliability-Based Optimisation of Chemical Vapour Deposition Process, International Journal of Reliability and Safety, 3(4), 363-383.
26. Giesl, P., 2007, ''Construction of Global Lyapunov Functions Using Radial Basis Functions,'' J.-M. Morel, C., F. Takens, G., and B. Teissier, P. eds., Lecture Notes in Mathematics, Springer-Verlag Berlin Heidelberg.
27. Giling, L.J., 1982, Gas Flow Patterns in Horizontal Epitaxial Reactor Cells Observed by Interference Holography, Journal of The Electrochemical Society, 129(3), 634-644. doi: 10.1149/1.2123939
28. Gladfelter, W.L., 1993, Selective Metallization by Chemical Vapor Deposition, Chemistry of Materials, 5, 1372-1388.
29. Goodwin, D.G., 1993, Scaling Laws for Diamond Chemical Vapor Deposition. I. Diamond Surface Chemistry, Journal of Applied Physics, 74(11), 6888-6894. doi: 10.1063/1.355063
30. Gray, D.D. and Giorgini, A., 1976, The Validity of the Boussinesq Approximation for Liquids and Gases, International Journal of Heat and Mass Transfer, 19, 545-551. doi: 10.1016/0017-9310(76)90168-X
31. Hasofer, A.M. and Lind, N.C., 1974, Exact and Invariant Second-Moment Code Format, Journal of the Engineering Mechanics Division, 100(EM1), 111-121.
32. Hintermann, H.E., 1996, Advances and Development in CVD Technology, Materials Science and Engineering, A209, 366-371. doi: 10.1016/0921-5093(95)10131-4
33. nd ed., Prentice-Hall, Inc., Upper Saddle River, New Jersey.
34. Jaluria, Y., 1998, Design and Optimization of Thermal Systems, McGraw-Hill.
35. Jensen, K.F., Einset, E.O., and Fotiadis, D.I., 1991, Flow Phenomena in Chemical Vapor Deposition of Thin Films, Annual Review of Fluid Mechanics, 23, 197-232. doi: 10.1146/annurev.fl.23.010191.001213
36. nd AIAA Aerospace Sciences Meeting and Exhibit, Reno, NV.
37. Karki, K.C., Sathyamurthy, P.S., and Patankar, S.V., 1993, Three-Dimensional Mixed Convection in a Horizontal Chemical Vapor Deposition Reactor, Journal of Heat Transfer, 115(3), 803-806. doi: 10.1115/1.2910760
38. Kays, W.M. and London, A.L., 1984, Compact Heat Exchangers, McGraw-Hill, New York.
39. Kee, R.J., Ting, A., and Spence, P.A., 1995, Understanding and Improving Materials Processing Through Interpreting and Manipulating Predictive Models, Chemical Vapor Deposition of Refractory Metals and Ceramics III, Materials Research Society, 363, 314.
40. Kreider, J.F. and Rabl, A., 1994, Heating and Cooling of Buildings: Design for Efficiency, McGraw-Hill, New York.
41. Kurtz, S., Friedman, D., Geisz, J., and McMahon, W., 2007, Using MOVPE Growth to Generate Tomorrow's Solar Electricity, Journal of Crystal Growth, 298, 748-753. doi: 10.1016/j.jcrysgro.2006.10.176
42. Lau, K.K.S., Lewis, H.G.P., Limb, S.J., Kwan, M.C., and Gleason, K.K., 2001, Hot-Wire Chemical Vapor Deposition (HWCVD) of Fluorocarbon and Organosilicon Thin Films, Thin Solid Films, 395(1-2), 288-291. doi: 10.1016/S0040-6090(01)01287-1
43. Lebensztajn, L., Marretto, C.A.R., Costa, M.C., and Coulomb, J.-L., 2004, Kriging: A Useful Tool for Electromagnetic Device Optimization, IEEE Transaction on Magnetics, 40(2), 1196-1199. doi: 10.1109/TMAG.2004.824542
44. Lin, P.T., 2010, Parametric Modeling and Optimization of Thermal Systems with Design Uncertainties, Dissertation, Mechanical and Aerospace Engineering, Rutgers University.
45. Lin, P.T., Gea, H.C., and Jaluria, Y., 2009, A Modified Reliability Index Approach for Reliability-Based Design Optimization, DETC2009-87804, 2009 ASME International Design Engineering Technical Conferences & Computers and Information in Engineering Conference (IDETC/CIE), San Diego, CA, USA.
46. Lin, P.T., Jaluria, Y., and Gea, H.C., 2008, Parametric Modeling and Optimization of Chemical Vapor Deposition Process, DETC2008-50054, 2008 ASME International Design Engineering Technical Conferences & Computers and Information in Engineering Conference (IDETC/CIE), New York City, NY, USA.
47. Lin, P.T., Jaluria, Y., and Gea, H.C., 2009, ''Parametric Modeling and Optimization of Chemical Vapor Deposition Process,'' Journal of Manufacturing Science and Engineering, 131(1), 011011. doi: 10.1115/1.3063689
48. Ly, H.V. and Tran, H.T., 2002, Proper Orthogonal Decomposition for Flow Calculations and Optimal Control in a Horizontal CVD Reactor, Quarterly of Applied Mathematics, 60(4), 631-656.
49. Mahajan, R.L., 1996, ''Transport Phenomena in Chemical Vapor Deposition Systems,'' Advances in Heat Transfer, Academic Press, 339-425.
50. Mahajan, R.L. and Wei, C., 1991, Buoyancy, Soret, Dufour, and Variable Property Effects in Silicon Epitaxy, Journal of Heat Transfer, 113, 688-695.
51. y Layers Grown by Chemical Vapor Deposition, Applied Physics Letters, 71(12), 1688-1690. doi: 10.1063/1.119794
52. Moffat, H. and Jensen, K.F., 1986, Complex Flow Phenomena in MOCVD Reactors: I. Horizontal Reactors, Journal of Crystal Growth, 77, 108-119. doi: 10.1016/0022-0248(86)90290-3
53. Mortenson, M.E., 2006, Geometric Modeling, 3rd ed., Industrial Press Inc., New York.
54. Mouche, M.-J., Mermet, J.-L., Pires, F., Richard, E., Torres, J., Palleau, J., and Braud, F., 1995, Process Optimization of Copper MOCVD Using Modeling Experimental Design, Applied Surface Science, 91, 129-133. doi: 10.1016/0169-4332(95)00107-7
55. Myers, R.H., Montgomery, D.C., and Anderson-Cook, C.M., 2009, Response Surface Methodology: Process and Product Optimization Using Designed Experiments, 3rd ed., John Wiley & Sons, Inc., Hoboken, New Jersey.
56. Naslain, R. and Langlais, F., 1986, CVD Processing of Ceramic-Ceramic Composite Materials, Materials Science Research, 20, 145.
57. Nilsen, O., 2003, Growth of Thin Films of Functional Oxides with the ALCVD Method, Doctor Scientiarium, Department of Chemistry, Faculty of Mathematics and Natural Sciences, University of Oslo, Norway.
58. Patankar, S.V., 1980, Numerical Heat Transfer and Fluid Flow, Hemisphere Publishing Corporation.
59. Quazzani, J., Chiu, K.C., and Rosenberger, F., 1988, On the 2D Modelling of Horizontal CVD Reactors and Its Limitations, Journal of Crystal Growth, 91, 497-508. doi: 10.1016/0022-0248(88)90117-0
60. Quazzani, J. and Rosenberger, F., 1990, Three- Dimensional Modeling of Horizontal Chemical Vapor Deposition I. MOCVD at Atmospheric Pressure, Journal of Crystal Growth, 100, 545-576. doi: 10.1016/0022-0248(90)90256-K
61. Raja, L.L., Kee, R.J., Serban, R., and Petzold, L.R., 2000, ''Computational Algorithm for Dynamic Optimization of ChemicalVapor Deposition Processes in Stagnation Flow Reactors'' Journal of The Electrochemical Society, 147(7), 2718-2726. doi: 10.1149/1.1393595
62. Rebenne, H.E. and Bhat, D.G., 1994, Review of CVD TiN Coatings for Wear-Resistant Applications: Deposition Processes, Properties and Performance, Surface and Coatings Technology, 63, 1-13. doi: 10.1016/S0257-8972(05)80002-7
63. Sherman, A., 1987, Chemical Vapor Deposition for Microelectronics, Noyes Publications, Park Ridge, New Jersey, USA.
64. Simpson, T.W., Peplinski, J.D., Koch, P.N., and Allen, J.K., 2001, Metamodels for Computer-Based Engineering Design: Survey and Recommendations, Engineering with Computers, 17, 129-150. doi: 10.1007/PL00007198.
65. Southwell, R.P., Mendicino, M.A., and Seebauer, E.G., 1996, Optimization of Selective TiSi2 Chemical Vapor Deposition by Mechanistic Chemical Kinetics, The Journal of Vacuum Science and Technology A, 14(3), 928-934. doi: 10.1116/1.580417
66. Spall, R.E., 1996, Unsteady Mixed Convection in Horizontal Ducts with Applications to Chemical Vapor Deposition Processes, International Communications in Heat and Mass Transfer, 23(1), 115-122. doi: 10.1016/0735-1933(95)000895
67. Stein, M., 1987, Large Sample Properties of Simulations Using Latin Hypercube Sampling, Technometrics, 29(2), 143. doi: 10.2307/1269769
68. Steinberg, D.S., 1980, Cooling Techniques for Electronic Equipment, Wiley-Interscience, New York.
69. Stoecker, W.F. and Jones, J.W., 1982, Refrigeration and Air Conditioning, 2nd ed., McGraw-Hill, New York.
70. Stringfellow, G.B., 2001, Fundamental Aspects of Organometallic Vapor Phase Epitaxy, Materials Science and Engineering, B87, 97-116. doi: 10.1016/S0921-5107(01)00712-7
71. Sugawara, K., 1972, Silicon Epitaxial Growth by Rotating Disk Method, Journal of The Electrochemical Society, 119(12), 1749-1760. doi: 10.1149/1.2404093
72. Tu, J., Choi, K.K., and Park, Y.H., 1999, A New Study on Reliability Based Design Optimization, Journal of Mechanical Design, 121, 557-564. doi: 10.1115/1.2829499
73. Van Beers, W.C.M. and Kleijnen, J.P.C., 2003, Kriging for Interpolation in Random Simulation, Journal of the Operational Research Society, 54(3), 255-262. doi: 10.1057/palgrave.jors.2601492
74. Van Beers, W.C.M. and Kleijnen, J.P.C., 2004, ''Kriging Interpolation in Simulation: A Survey,'' Ingalls, R.G., Rossetti, M.D., Smith, J.S., and Peters, B.A. eds., Proceedings of the 36th Conference on Winter Simulation, 113-121.
75. Van Wylen, G.J. and Sonntag, R.E., 1986, Fundamentals of Classical Thermodynamics, 3rd ed., Wiley, New York.
76. Visser, E.P., Kleijn, C.R., Govers, C.A.M., Hoogendoorn, C.J., and Giling, L.J., 1989, Return Flows in Horizontal MOCVD Reactors Studied with the Use of TiO2 Particle Injection and Numerical Calculations, Journal of Crystal Growth, 94, 924-946. doi: 10.1016/0022-0248(89)90127-9
77. Wahl, G., 1977, Hydrodynamic Description of CVD (Chemical Vapour Deposition) Processes, Thin Solid Films, 40(1-3), 13-26. doi: 10.1016/0040-6090(77)90099-2
78. Wang, C.A., Groves, S.H., Palmateer, S.C., Weyburne, D.W., and Brown, R.A., 1986, Flow Visualization Studies for Optimization of OMVPE Reactor Design Journal of Crystal Growth, 77(1-3), 136-143. doi: 10.1016/0022-0248(86)90293-9
79. Wang, Q., Yoo, H., and Jaluria, Y., 2003, Convection in a Horizontal Duct under Constant and Variable Property Formulations, International Journal of Heat and Mass Transfer, 46, 297-310. doi: 10.1016/S0017-9310(02)00272-7
80. Wendland, H., 1995, Piecewise Polynomial, Positive Definite and Compactly Supported Radial Functions of Minimal Degree, Advances in Computational Mathematics, 4(1), 389-396. doi: 10.1007/BF02123482
81. Yang, R.J. and Gu, L., 2004, Experience with Approximate Reliability-Based Optimization Methods, Structural and Multidisciplinary Optimization, 26(2), 152-159. doi: 10.1007/s00158-003-0319-2
82. Yang, Y.-T. and Peng, H.-S., 2008, Numerical Study of Pin-Fin Heat Sink with Un-Uniform Fin Height Design, International Journal of Heat and Mass Transfer, 51(19-20), 4788-4796. doi: 10.1016/j.ijheatmasstransfer.2008.02.017
83. Yang, Y.-T. and Peng, H.-S., 2009, Numerical Study of the Heat Sink with Un-Uniform Fin Width Designs, International Journal of Heat and Mass Transfer, 52(15-16), 3473-3480. doi: 10.1016/j.ijheatmasstransfer.2009.02.042
84. Yoo, H. and Jaluria, Y., 2002, Thermal Aspects in the Continuous Chemical Vapor Deposition in Silicon, Journal of Heat Transfer, 124, 938-946. doi: 10.1115/1.1482084
85. Youn, B.D. and Choi, K.K., 2004, An Investigation of Nonlinearity of Reliability-Based Design Optimization Approaches, Journal of Mechanical Design, 126(3), 403-411. doi: 10.1115/1.1701880