Through-silicon via and die stacking technologies for microsystems- integration

Technical Digest - International Electron Devices Meeting, IEDM

Volumn , Issue , 2008, Pages

  Beyne, Eric ^a   De Moor, Piet ^a   Ruythooren, Wouter ^a   Labie, Riet ^a   Jourdain, Anne ^a   Tilmans, Harrie ^a   Tezcan, Deniz Sabuncuoglu ^a   Soussan, Philippe ^a   Swinnen, Bart ^a   Cartuyvels, Rudi ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 64549150493     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEDM.2008.4796734     Document Type: Conference Paper

References (8)

1. E.Beyne, "3D Interconnection and packaging: impending reality or still a dream?" IEEE ISSCC2004, 15-19 February 2004; San Francisco, CA, pp.138-145.
2. E.Beyne, "Technologies for very high bandwidth electrical interconnects between next generation VLSI circuits", IEEE-IEDM 2001 Technical Digest, December 2-5, Washington, D.C., S23-p3, 2001.
3. E.Beyne, "The rise of the 3rd dimension for system integration", IEEE-IITC, 5-7 July 2006, San Francisco, CA, USA, 2006, 1-5.
4. H.A.C. Tilmans, M. van de Peer, E. Beyne, The indent reflow sealing (IRS) technique-a method for the fabrication of sealed cavities for MEMS devices, Journal of Microelectromechanical Systems, Vol. 9, 2, June 2000, pp. 206 - 217
5. G.Carchon, A. Jourdain, O. Vendier, J. Schoebel, H.A.C. Tilmans, Integration of 0/1-Level Packaged RF-MEMS Devices on MCM-D at Millimeter-Wave Frequencies, IEEE Transactions on Advanced Packaging, Vol.30, 3, Aug. 2007, pp.369 - 376
6. W. Ruythooren, A. Beltran, R. Labie, Cu-Cu Bonding Alternative to Solder based Micro-Bumping, Electronics Packaging Technology Conference, EPTC 2007. Singapore, 10-12 Dec. 2007, pp. 315 - 318
7. E.Beyne, "Cost effective 3D-system integration using through-silicon-via technologies", Semi Technology Symposium, 7 December 2007, Makuhari, Japan, 2007, S9P1.
8. D. Sabuncuoglu Tezcan et al "Sloped through wafer vias for 3D Wafer Level packaging", Proc. 57th IEEE ECTC 2007, May 29-June 1, Reno, NV, USA, 2007.