Fabrication and evaluation of 3D packages with through hole via

Materials Research Society Symposium Proceedings

Volumn 970, Issue , 2007, Pages 171-178

  Jang, Dong Min ^a   Lee, Kwang Yong ^b   Ryu, Chung Hyun ^a   Cho, Byeong Hoon ^a   Oh, Tae Sung ^b   Kim, Joung Ho ^a   Lee, Won Jong ^a   Yu, Jin ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Hong Ik University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING; HOLE CONCENTRATION; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; SILICON COMPOUNDS; TIME DOMAIN ANALYSIS;

ELECTRONIC PACKAGING; EYE-DIAGRAM MEASUREMENT; MULTI-CHIP STACKING; SYSTEM IN PACKAGE;

ELECTRONICS PACKAGING;

EID: 34250791497     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. S. F. Al-Sarawi, D. Abbott, and P. D. Franzon, IEEE Trans. CPMT. 21B, 2 (1988)
2. S. Sheng, A. Chandrakasan, and R. W. Brodersen, IEEE Commun. Mag. 30, 64 (1992)
3. R. E. Terrill, Proc. 1995 Int. Conf. Multichip Modules, Denver, CO, 7-11 (1995)
4. R. Crowley, "Three-dimensional electronics packaging", Tech. Rep., Techsearch Int. Inc. Austin, TX, 159-161 (1993)
5. O. Ehrmann, K. Buschick, G. Chmiel, and A. Pareds, Proc. Int. Conf. Multichip Modules, Denver, CO (1995)
6. H. Kanbach, J. Wilde, F. Kriebel, and E. Meusel, Int. Conf. on High Density Packaging and MCMs, 248-253 (1999)
7. M. Karnezos, F. Carson and R. Pendse, "3D packaging promises performance, reliability gains with small footprints and lower profiles", Chip Scale Review (2005)
8. K. Takahashi, H. Terao, Y. Tomita, Y. Yamaji, M. Hoshino, T. Sato, T. Morifuji, M. Sunohara and M.Bonkohara, Jpn. J. Appl. Phys. 40, 3032 (2001)
9. T. Matsumoto, "Three-dimensional integration technology based on wafer bonding technique using micro-bumps", Ext. Abstr. Int. Conf. Solid State Devices Mater. Osaka., Japan, 1073-1073 (1995)
10. P. Ramm, Microelectron. Eng. 37, 39 (1997)
11. K. Y. Lee, Y. H. Lee, Y. H. Kim, and T. S. Oh, J. Kor. Inst. Met. Mater. 43, 248 (2005)