Nano materials for microelectronic and photonic packaging

Frontiers of Optoelectronics in China

Volumn 3, Issue 2, 2010, Pages 139-142

  Wong, Ching Ping ^a   Lin, Wei ^a   Zhu, Ling Bo ^a   Jiang, Hong Jin ^a   Zhang, Rong Wei ^a   Li, Yi ^a   Moon, Kyoung Sik ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

carbon nanotube; electrical interconnect; molecular wire; thermal management

Indexed keywords

EID: 79951860778     PISSN: 16744128     EISSN: 16744594     Source Type: Journal    
DOI: 10.1007/s12200-010-0009-9     Document Type: Review

References (18)

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2. Zhu L B, Xiu Y H, Hess D W, Wong C P. Aligned carbon nanotube stacks by water-assisted selective etching. Nano Letters, 2005, 5(12): 2641-2645.
3. Jiang H J, Zhu L B, Moon K S, Wong C P. The preparation of stable metal nanoparticles on carbon nanotubes whose surfaces were modified during production. Carbon, 2007, 45(3): 655-661.
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6. Lin W, Moon K S, Wong C P. A combined process of in situ functionalization and microwave treatment to achieve ultrasmall thermal expansion of aligned carbon nanotube-polymer nanocomposites: toward applications as thermal interface materials. Advanced Materials, 2009, 21(23): 2421-2424.
7. Lin W, Zhang R W, Moon K S, Wong C P. Molecular phonon couplers at carbon nanotube/substrate interface to enhance interfacial thermal transport. Carbon, 2010, 48(1): 107-113.
8. Lin W, Olivares R V, Liang Q Z, Zhang RW, Moon K S, Wong C P. Vertically aligned carbon nanotubes on copper substrates for applications as thermal interface materials: from synthesis to assembly. In: Proceedings of Electronic Components and Technology Conference. San Diego, 2009, 441-447.
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