New Electrically Conductive Adhesives (ECAs) for flexible interconnect applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1356-1360

  Zhang, Rongwei ^a   Duan, Yiqun ^a   Lin, Wei ^a   Moon, Kyoung Sik ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION STRENGTHS; AU SURFACES; COATED GLASS; DIFUNCTIONAL; ELECTRICAL PROPERTY; ELECTRICALLY CONDUCTIVE ADHESIVES; FLEXIBLE ELECTRONICS; INTERCONNECT APPLICATIONS; MATERIAL PROPERTY; PARTICLE-PARTICLE INTERFACES; POLYMER MATRICES;

BLENDING; CONDUCTIVE FILMS; GLASS FIBERS; MECHANICAL PROPERTIES; SILVER;

ELECTRIC PROPERTIES;

EID: 70349670721     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074189     Document Type: Conference Paper

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