Highly reliable, low cost, isotropically conductive adhesives filled with Ag-coated Cu flakes for electronic packaging applications

International Journal of Adhesion and Adhesives

Volumn 30, Issue 6, 2010, Pages 403-407

  Zhang, Rongwei ^a   Lin, Wei ^a   Lawrence, Kevin ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

Composites; Epoxy; Silane coupling agent; Surface modification

Indexed keywords

ELECTRONIC PACKAGING; HIGH COSTS; ISOTROPICALLY CONDUCTIVE ADHESIVES; LOW COSTS; REFLOW TEMPERATURES; SILANE COUPLING AGENT; SURFACE MODIFICATION;

ADHESIVES; COSTS; COUPLING AGENTS; ELECTRONICS PACKAGING; FILLERS; ORGANIC COMPOUNDS;

SILVER;

EID: 77954213848     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2010.01.004     Document Type: Article

References (32)

1. Y. Li, K.S. Moon, and C.P. Wong Electronics without lead Science 308 2005 1419 1420
2. Y. Li, and C.P. Wong Recent advances of conductive adhesives as a lead free alternative in electronic packaging: materials, processing, reliability and applications Mater Sci Eng R: Rep R51 2006 1 35
3. D.D. Lu, and C.P. Wong Recent advances in developing high performance isotropic conductive adhesives J Adhes Sci Technol 22 2008 835 851
4. M.J. Yim, and K.W. Paik Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications Int J Adhes Adhes 26 2006 304 313
5. I. Mir, and D. Kumar Recent advances in isotropic conductive adhesives for electronics packaging applications Int J Adhes Adhes 28 2008 362 371
6. J. Liu Conductive adhesives for electronics packaging 1999 Electrochemical Publications Ltd. UK [Chapter 1]
7. Zhang R, Moon KS, Lin W, Wong CP. Preparation of highly conductive polymer nanocomposites by low temperature sintering of silver nanoparticles. J Mater Chem 2010;20:201823.
8. S.K. Kang, S.L. Buchwalter, N.C. LaBianca, J. Gelorme, S. Purushothaman, and K. Papathomas Development of conducting adhesive materials for via fill applications IEEE Trans Components Packag Technol 24 2001 431 435
9. H.P. Wu, J.F. Liu, X.J. Wu, M.Y. Ge, Y.W. Wang, and G.Q. Zhang High conductivity of isotropic conductive adhesives filled with silver nanowires Int J Adhes Adhes 26 2006 617 621
10. D. Lu, and C.P. Wong Isotropic conductive adhesives filled with low-melting-point alloy fillers IEEE Trans Electron Packag Manuf 23 2000 185 190
11. R. Zhang, Y. Li, M.J. Yim, K.S. Moon, D.D. Lu, and C.P. Wong Enhanced electrical properties of anisotropic conductive adhesive with pi-conjugated self-assembled molecular wire junctions IEEE Trans Components Packag Technol 32 2009 677 683
12. M.J. Yim, Y. Li, K.S. Moon, and C.P. Wong Oxidation prevention and electrical property enhancement of copper-filled isotropically conductive adhesives J Electron Mater 36 2007 1341 1347
13. Y.S. Lin, and S.S. Chiu Electrical properties of copper-filled electrically conductive adhesives and pressure dependent conduction behavior of copper particles J Adhes Sci Technol 22 2008 1673 1697
14. H. Nishikawa, S. Mikami, N. Terada, K. Miyake, A. Aoki, and T. Takemoto Electrical property of conductive adhesives using silver coated copper filler IEEE 2nd Electron Syst Integration Technol Conf 2008 825 828
15. Y.S. Lin, and S.S. Chiu Effects of oxidation and particle shape on critical volume fractions of silver coated copper powders in conductive adhesives for microelectronic applications Polym Eng Sci 44 2004 2075 2082
16. S.Y. Park, T.W. Yoon, C.H. Lee, I.B. Jeong, and S.H. Hyun Surface modification of Ag coated Cu conductive metal powder for conductive silicone sealant gasket paste Mater Sci Forum 5346 2007 933 936
17. V. Brusic, M.A. Frisch, B.N. Eldridge, F.P. Novak, F.B. Kaufman, and B.M. Rush Copper corrosion with and without inhibitors J Electrochem Soc 138 1991 2253 2259
18. A.M. Fenelon, and C.B. Breslin An electrochemical study of the formation of benzotriazole surface films on copper, zinc and a copper zinc alloy J Appl Electrochem 31 2001 509 516
19. E. Stupnisek Lisac, A. Brnada, and A.D. Mance Secondary amines as copper corrosion inhibitors in acid media Corros Sci 42 2000 243 257
20. M.N. Desai, and S.S. Rana Inhibition of the corrosion of copper in nitric acid. Aniline and other substituted aromatic amines Anti-Corros Methods Mater 20 1973 16 20
21. S. Abd El Wanees Amines as inhibitors for corrosion of copper in nitric acid Anti-Corros Methods Mater 41 1994 3 7
22. E.M. Sherif, and S.M. Park Inhibition of copper corrosion in 3.0% NaCl solution by N-phenyl-1,4-phenylenediamine J Electrochem Soc 152 2005 B428 B433
23. E.M. Sherif, and S.M. Park Inhibition of copper corrosion in acidic pickling solutions by N-phenyl-1,4-phenylenediamine Electrochim Acta 51 2006 4665 4673
24. S.B. Chakraborty, T.K. Bandyopadhyay, and S.R. Chaudhuri Amino acids as corrosion inhibitor for copper in nitric acid Bull Electrochem 8 1992 111 113
25. M.M. Antonijevic, and M.B. Petrovic Copper corrosion inhibitors. A review Int J Electrochem Sci 3 2008 1 28
26. S. Patil, S.R. Sainkar, and P.P. Patil Poly(o-anisidine) coatings on copper: synthesis, characterization and evaluation of corrosion protection performance Appl Surf Sci 225 2004 204 216
27. F. Tan, X. Qiao, J. Chen, and H. Wang Effects of coupling agents on the properties of epoxy-based electrically conductive adhesives Int J Adhes Adhes 26 2006 406 413
28. D.I. Tee, M. Mariatti, A. Azizan, C.H. See, and K.F. Chong Effect of silane-based coupling agent on the properties of silver nanoparticles filled epoxy composites Compos Sci Technol 67 2007 2584 2591
29. A. Wokaun, A. Baiker, S.K. Miller, and W. Fluhr Adsorption on catalyst surfaces studied by enhanced Raman scattering J Phys Chem 89 1985 1910 1914
30. Zwolinski M, Hickman J, Rubin H, Zaks Y. Electrically conductive adhesives for surface mount solder replacement. In: Proceedings of the second international conference on adhesive joining and coating technology in electronics manufacturing, Stockholm, Sweden, 1996. p. 33340.
31. M. Inoue, H. Muta, T. Maekawa, S. Yamanaka, and K. Suganuma Temperature dependence of electrical and thermal conductivities of an epoxy-based isotropic conductive adhesive J Electron Mater 37 2008 462 468
32. D. Lu, and C.P. Wong Effects of shrinkage on conductivity of isotropic conductive adhesives Int J Adhes Adhes 20 2000 189 193