Novel isotropical conductive adhesives for electronic packaging application

IEEE Transactions on Advanced Packaging

Volumn 32, Issue 3, 2009, Pages 589-592

  Tao, Yu ^a   Xia, Yanping ^a   Wang, Hui ^a   Gong, Fanghong ^a   Wu, Haiping ^a   Tao, Guoliang ^a  

^a CHANGZHOU UNIVERSITY   (China)

Author keywords

Isotropic conductive adhesives; Percolation threshold; Silver nanowires; Tunneling effect

Indexed keywords

AG NANOWIRES; AG PARTICLES; BULK RESISTIVITY; CONDUCTIVE ADHESIVE; CONDUCTIVE FILLERS; ELECTRICAL PROPERTY; ELECTRONIC INDUSTRIES; ELECTRONIC PACKAGING; ISOTROPIC CONDUCTIVE ADHESIVES; NANO-SIZED; PERCOLATION THRESHOLD; PERCOLATION THRESHOLD VALUE; POLYVINYL PYRROLIDONE; SILVER NANOWIRES; SILVER NITRATES; SILVER PARTICLES; SOLUTION PHASE METHODS; THEORY CALCULATION; TUNNELING EFFECT;

ADHESIVES; ELECTRIC PROPERTIES; ELECTRIC RESISTANCE MEASUREMENT; ELECTRIC WIRE; ELECTRONICS PACKAGING; ETHYLENE; ETHYLENE GLYCOL; HEMODYNAMICS; INDEPENDENT COMPONENT ANALYSIS; LEAD; MECHANICAL PROPERTIES; NANOWIRES; PERCOLATION (COMPUTER STORAGE); PERCOLATION (FLUIDS); PERCOLATION (SOLID STATE); SHEAR STRENGTH; SOLVENTS; TUNNELING (EXCAVATION); WIND TUNNELS;

SILVER;

EID: 68949175647     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2009.2018141     Document Type: Article

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