Nano- and micro-filled conducting adhesives for z-axis interconnections: New direction for high-speed, high-density, organic microelectronics packaging

Circuit World

Volumn 34, Issue 1, 2008, Pages 3-12

  Das, Rabindra N ^a   Egitto, Frank D ^a   Markovich, Voya R ^a  

^a Endicott Interconnect Technologies Inc   (United States)

Author keywords

Adhesives; Electronic engineering; Printed circuits; Semiconductor devices

Indexed keywords

ADHESIVES; CONDUCTIVE MATERIALS; ELECTRONICS ENGINEERING; MICROSTRUCTURE; PRINTED CIRCUITS; RELIABILITY; STRENGTH OF MATERIALS; TENSILE STRENGTH;

CONDUCTING ADHESIVES; ORGANIC MICROELECTRONICS; Z-AXIS INTERCONNECTIONS;

MICROELECTRONICS;

EID: 39049127366     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120810848743     Document Type: Article

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