Novel PDMS(silicone)-in-PDMS(silicone): Low cost flexible electronics without metallization

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1226-1230

  Agar, Joshua C ^a   Lin, Katy J ^a   Zhang, Rongwei ^a   Durden, Jessica ^a   Moon, Kyoung Sik ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BIMODAL DISTRIBUTION; COMPOSITE MATRIX MATERIALS; CURING TEMPERATURE; ELECTRICAL PROPERTY; ELECTRICALLY CONDUCTIVE; ELECTRICALLY CONDUCTIVE ADHESIVES; FLEXIBLE DEVICE; FLEXIBLE PACKAGES; HIGH RESOLUTION; LOW COSTS; METALLIZATIONS; NATURAL INTEGRATION; NATURAL INTERFACES; PACKAGE LEVELS; PDMS (SILICONE); THERMALLY STABLE;

ASPECT RATIO; CONSUMER ELECTRONICS; COSTS; CURING; ELECTRIC PROPERTIES; METALLIZING; MICROCHANNELS; MOLDS; PACKAGING; SILICONES; SILVER; SUBSTRATES; TECHNOLOGY;

FLEXIBLE ELECTRONICS;

EID: 77955178792     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490654     Document Type: Conference Paper

References (5)

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