A multi-step electrochemical etching process for a three-dimensional micro probe array

Journal of Micromechanics and Microengineering

Volumn 21, Issue 1, 2011, Pages

  Kim, Yoonji ^a   Youn, Sechan ^a   Cho, Young Ho ^a   Park, Hojoon ^b   Chang, Byeung Gyu ^b   Oh, Yong Soo ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Samsung Electro Mechanics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT FORCES; ETCH RATES; EXPERIMENTAL STUDIES; FABRICATION ERRORS; FOIL ETCHING; FOIL ETCHING PROCESS; MATERIAL PROPERTY; METALLIC MICROSTRUCTURES; MICRO-PROBES; MULTI-STEP; SINGLE-STEP; SINGLE-STEP PROCESS; THREE-DIMENSIONAL (3D);

ALUMINUM; ALUMINUM FOIL; ELECTROCHEMICAL PROPERTIES; FABRICATION; PROBES; SURFACE ROUGHNESS; THREE DIMENSIONAL;

ELECTROCHEMICAL ETCHING;

EID: 78651494058     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/21/1/015019     Document Type: Article

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