Uses of electroplated aluminum for the development of microstructures and micromachining processes

Journal of Microelectromechanical Systems

Volumn 6, Issue 2, 1997, Pages 91-98

  Frazier, A Bruno ^a,b   Allen, Mark G ^a,c  

^a IEEE   (United States)

^b UNIVERSITY OF UTAH   (United States)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Aluminum; Electroplating; Micromolding

Indexed keywords

ALUMINUM PLATING; ASPECT RATIO; ELECTRODEPOSITION; ELECTROPLATING; MICROMACHINING; MICROSTRUCTURE;

MICROMOLDING;

ALUMINUM;

EID: 0031168031     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.585786     Document Type: Article

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