Embedded IC technology for compact packaging inside aluminum substrate (pocket embedded packaging)

Proceedings of the 37th European Microwave Conference, EUMC

Volumn , Issue , 2007, Pages 1125-1128

  Kim, Kyoung Min ^a   Yook, Jorig Min ^a   Yeo, Surig Ku ^a   Kwon, Young Se ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ALUMINUM; CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT MANUFACTURE; LIGHT METALS; MICROWAVES; POWDERS; SUBSTRATES; TECHNOLOGY;

ALUMI NUM OXIDE; ALUMINUM SUBSTRATES; ANODIZED ALUMINUM; COMPACT PACKAGING; EUROPEAN; IC TECHNOLOGIES; MICROWAVE SYSTEMS; PACKAGING TECHNOLOGIES; RF PERFORMANCE;

ELECTRONICS PACKAGING;

EID: 48349114030     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMC.2007.4405396     Document Type: Conference Paper

References (12)

1. Seong-Ho Shin, Ju Hyang Lee, Bo-In Sohn, Seung-Han Ryu, and Young-Se Kwon, "PCS Power amplifier module package using selectively anodized aluminum substrate", European Microwave conference, pp. 1767-1770, Sept 2006.
2. Ju-Hyang Lee, Seong-Ho Shin, K.M. Kim, and Young-Se Kwon, "Fabrication and Analysis of High-Q Inductor on anodized aluminum for High Power Package," European Microwave conference, pp. 1387-1390, Sept 2006.
3. Seong-Ho Shin and Young-Se Kown, "Selectively Anodized Substrates for Microwave Power Module Package", 2005 Electronic Components and Technology Conference, pp 1904-1908, 2005.
4. Songsheng Tan, Mechael Reed "High Aspect Ratio Microstructures on Porous Anodic Aluminum Oxide", Micro electro Mechanical systems, 1995, MEMS'95, Proceedings, pp 267-272, 1995
5. Ahmed Nadeem, Mark Mescher, Keith Rebello, Lee E. Weiss, Clarence Wu, Marc Feldman, and Michael L. Reed, "Fabrication of Microstructures using Aluminum Anodiztion Techniques", Micro Electro Mechanical Systems, 1998. MEMS'98. Proceedings., the eleventh Annual International Workshop, pp 274-277, 1998.
6. M.Nagayama. K. Tamura and H. Takahashi "Dissolution of porus anodic oxide films on Al in (COOH)2 solutions". Corrosion Science. vol. 10. pp 617-627, 1970.
7. M. Nagayama, K. Tamura and H. Takahashi "Mechanism of Open-circuit dissolution of porous oxide films on aluminum in acid solutions", Corrosion Science, voll2, pp133-136, 1972.
8. I.Vrublevsky, V.Parkoun, J.Schreckenbach and G. Marx "Study of porous oxide film growth on aluminum in oxalic acid using a reanodizing technique" Applied Surface Science, vol 227, pp282-292, 2004.
9. R.Cavin and W.Liu, "Emerging Technologies: Designing Low Power Digital system", IEEE Press Piscataway.NJ, 1996.
10. J.Dougherty et al., "The NEMI roadmap: Integrated Passives technology and economics," in Proc. 2003 CARTS Conference, Scottsdale, AZ, Mar.31, 2003.
11. S.Pinel, C.-H.Lee, S.-W. Yoon, S.Nuttinck, K.Lim, and J.Laskar. "Embedded IC and High-Q Passive Technology for Ultra-Compact Ku-Band VCO Module" IEEE Microwave and Wireless components letters. voll4. no.2,p80-82, Feb 2004.
12. K.Lim, S. Pinel, M.Davis, A.Sutono, C.-H. Lee, D.Heo, J.Laskar, M.Tantzeris, andR.Tummala, "RF-SOP for wireless communications," Microwave Mag., Mar.2002.