Lead-free solder process implementation for PCB assembly

Soldering & Surface Mount Technology

Volumn 14, Issue 3, 2002, Pages 12-18

  Collier, Peter ^a   Sunappan, Vasudivan ^a   Periannan, Arulvanan ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Lead free soldering; Printed circuit boards; Reliability

Indexed keywords

ASSEMBLY; ELECTRONICS PACKAGING; LEAD; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS;

LEAD-FREE ALLOYS;

PRINTED CIRCUIT BOARDS;

EID: 18644383748     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910210444674     Document Type: Article

References (8)

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3. Pang, J., Ang, K.H., Shi, X.Q. and Wang, Z.P. (2001), “Mechanical deflection system (MDS) test and methodology for PBGA solder joint reliability”, IEEE Transactions on Advanced Packaging, Vol. 24 No. 4, pp. 507–14.
4. Richards, B. and Nimmo, K. (2000), An analysis of the current status of lead-free soldering - Update 2000, URN 00/750 DTI (UK), Available http:/www.lead-free.org/download
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6. Vianco, P. and Regent, J. (1996), “Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronics assemblies”, 46th IEEE Electronics Components and Technology Conference, (Orlando, Florida), pp. 1172–83.
7. Warwick, M. (1999), “Implementing lead free soldering - European consortium research”, SMTA International, Proceedings of the Technical Program, Conference Proceedings, Surface Mount Technology Association, (Edina, MN, USA), pp. 378–98.
8. Yost, F.G. and Romig, A.D. Jr (1988), “Thermodynamics of wetting by liquid metals”, Materials Research Society Symposium Proceedings, Vol. 108, pp. 385–90.