The effects of adding silver and indium to lead-free solders

Welding Journal (Miami, Fla)

Volumn 88, Issue 4, 2009, Pages 45-48

  Dharma, I G B Budi ^a   Hamdi, M ^a   Ariga, T ^b  

^a UNIVERSITY OF MALAYA   (Malaysia)

^b TOKAI UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ARGON GAS; ATOMIC SIZES; LEAD-FREE SOLDERS; MICRO-HARDNESS TESTS; ONSET TEMPERATURES; ROOM TEMPERATURES; SOLDER ALLOYS; THERMAL ANALYSIS; VICKERS HARDNESS NUMBERS; WETTING BALANCES; WETTING FORCES; WETTING TIME;

ALLOYS; ARGON; BRAZING; COPPER ALLOYS; DIFFERENTIAL SCANNING CALORIMETRY; INDIUM; LEAD; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; THERMOANALYSIS; TIN ALLOYS; VICKERS HARDNESS; WELDING; WETTING;

TIN;

EID: 64949112159     PISSN: 00432296     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (13)

1. Suganuma, K. 2001. Current Opinion in Solid State and Materials Science (5): 55-64.
2. Puttlitz, K. J., and Stalter, K. A. 2004. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, Marcel Dekker Inc.
3. Vincent, J. H., and Humpston, G. 1994. GEC Journal of Research (11): 76-89.
4. Yoon, J. W, Kim, S. W., Koo, J. M., Kim, D. G., and Jung, S. B. 2004. Journal of Electronic Material (33): 1190-1199.
5. Ohnuma, I., Miyashita, M. K., Anzai, X. J. Liu, Ohtani, H., Kaninuma, R., and Ishida, K. 2000, Journal of Electronic Material (29): 1137-1144.
6. Mei, Z., and Morris, J. W. 1992. Journal of Electronic Material (21): 401.
7. Abtew, M., and Selvaduray, G. 2000. Materials Science and Engineering R: Reports. 27 (5): 95-141.
8. Nurmi, S., Sundelin, J., Ristolainen, E., and Lepisto, T. 2004. Microelectronic Reliability (44): 485-194.
9. Park, J. Y., Kang, C. S., and Jung, J. P. 1999. Journal of Electronic Materials: 28.
10. Lopez, E. P., Vianco, P. T., and Rejent, J. A. 2003. Journal of Electronic Materials, p. 32.
11. Wu, C. M. L., Law, C. M. T., Yu, D. Q., and Wang, L. 2003. Journal of Electronic Materials, p. 32.
12. Seok-Hwan, H., Keun-Soo, K., and Katsuaki, S. 2001. Material Transactions (42): 739-744.
13. Huang, M. L., and Wang, L. 2005. Metallurgical and Materials Transactions A 36A:1439-1446.